XC7K325T-3FFG900E

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Terminal Pitch :

1mm

Published :

2009

HTS Code :

8542.39.00.01

Combinatorial Delay of a CLB-Max :

0.58 ns

Number of Terminations :

900

Moisture Sensitivity Level (MSL) :

4 (72 Hours)

Number of Logic Elements/Cells :

326080

RoHS Status :

ROHS3 Compliant

Package / Case :

900-BBGA, FCBGA

Qualification Status :

Not Qualified

Total RAM Bits :

16404480

ECCN Code :

3A991.D

RAM Size :

2MB

Pbfree Code :

yes

Number of Outputs :

500

Reach Compliance Code :

not_compliant

Power Supplies :

11.83.3V

Surface Mount :

yes

Mounting Type :

Surface Mount

Factory Lead Time :

11 Weeks

Number of I/O :

500

Memory Type :

DDR3

JESD-30 Code :

S-PBGA-B900

Packaging :

Tray

Memory Size :

1GB

Supply Voltage :

1V

Height Seated (Max) :

3.35mm

Length :

31mm

Number of LABs/CLBs :

25475

Width :

31mm

Base Part Number :

XC7K325T

Clock Frequency :

1412MHz

Pin Count :

900

Terminal Form :

Ball

Series :

Kintex®-7

Voltage - Supply :

0.97V~1.03V

Number of Inputs :

500

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Operating Temperature :

0°C~100°C TJ

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Position :

BOTTOM

Number of Registers :

407600

Speed Grade :

-3

JESD-609 Code :

e1

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY