XC7K325T-3FBG676E
Or copy the link below:
- Mfr.Part #
- XC7K325T-3FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 990
- In Stock ：
- 990
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 11 Weeks
- JESD-609 Code :
- e1
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- Length :
- 27mm
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- 0°C~100°C TJ
- Clock Frequency :
- 1412MHz
- Power Supplies :
- 11.83.3V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Pbfree Code :
- yes
- Base Part Number :
- XC7K325T
- Number of Outputs :
- 400
- Width :
- 27mm
- Pin Count :
- 676
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- Total RAM Bits :
- 16404480
- Number of Terminations :
- 676
- Published :
- 2010
- Height Seated (Max) :
- 2.54mm
- Voltage - Supply :
- 0.97V~1.03V
- Surface Mount :
- yes
- Series :
- Kintex®-7
- Number of LABs/CLBs :
- 25475
- Number of Logic Elements/Cells :
- 326080
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- RAM Size :
- 2MB
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1V
- Package / Case :
- 676-BBGA, FCBGA
- Packaging :
- Tray
- Number of Pins :
- 676
- Number of Registers :
- 407600
- Terminal Form :
- Ball
- Operating Supply Voltage :
- 1V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Speed Grade :
- -3
- Number of I/O :
- 400
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Datasheets
- XC7K325T-3FBG676E
FPGAs AMD Xilinx XC7K325T-3FBG676E Overview
The FPGAs AMD Xilinx XC7K325T-3FBG676E is a high-performance Field Programmable Gate Array designed to meet the needs of advanced digital processing systems. This IC FPGA features a robust 676-pin flip-chip Ball Grid Array (FCBGA) package and offers up to 400 I/O options, providing ample flexibility for interfacing with other key system components. Engineered by AMD Xilinx, a leader in digital circuit technology, this FPGA enables designers to achieve high-speed, reliable, and efficient solutions for a variety of complex electronic applications. Its adaptability and high function integration make it an excellent choice for developers looking to harness the power of a programmable logic device that supports extensive logic operations and connectivity options.
XC7K325T-3FBG676E Features
This FPGA is equipped with multiple key features that facilitate superior performance in demanding environments:
- High I/O pin count (400 I/O) for extensive connectivity.
- Dense 676-pin FCBGA packaging ensures a compact form factor.
- Advanced node used by AMD Xilinx promotes higher speed and lower power consumption.
- Configurable logic blocks for tailored functionality and improved performance efficiency.
- Integrated DSP slices for enhanced signal processing capabilities.
XC7K325T-3FBG676E Applications
- Telecommunications Equipment
In telecommunications, the XC7K325T-3FBG676E FPGA can be utilized to manage signal processing tasks, data flow control, and interface protocols, enhancing both the speed and reliability of network communications.
- Automotive Driver Assistance Systems
This FPGA helps in automotive applications by processing real-time data from sensors and cameras, crucial for features such as collision detection, lane assistance, and adaptive cruise control.
- Data Center Solutions
Used in data centers, the XC7K325T-3FBG676E can accelerate data processing tasks, manage high-speed data transfers, and support complex algorithms for cloud computing services.
- Medical Imaging Equipment
In medical imaging, this FPGA provides the necessary speed and data handling capabilities required for high-resolution imaging technologies like MRI and CT scans.
- Consumer Electronics
For consumer electronics, such as high-definition video streaming devices and gaming consoles, the XC7K325T-3FBG676E enhances graphical processing and user interface interactions.
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
Manufacturer related products
Catalog related products
Related products
- Follow Us
-
- Payment
-
- Subscribe
- Certification
-
-
