XC7K325T-2FFV900I

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Width :

31mm

Terminal Pitch :

1mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Number of CLBs :

25475

Operating Temperature (Min) :

-40°C

Series :

Kintex®-7

Surface Mount :

yes

Height Seated (Max) :

3.35mm

RoHS Status :

Non-RoHS Compliant

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Total RAM Bits :

16404480

Operating Temperature (Max) :

100°C

Terminal Position :

BOTTOM

Number of Terminations :

900

ECCN Code :

3A991.D

Supplier Device Package :

900-FCBGA (31x31)

Number of I/O :

500

HTS Code :

8542.39.00.01

Supply Voltage-Min (Vsup) :

0.97V

Package :

Tray

Length :

31mm

Voltage - Supply :

0.97V ~ 1.03V

Supply Voltage :

1V

Supply Voltage-Max (Vsup) :

1.03V

Terminal Form :

Ball

Operating Temperature :

-40°C ~ 100°C (TJ)

Combinatorial Delay of a CLB-Max :

0.61 ns

Number of LABs/CLBs :

25475

Mounting Type :

Surface Mount

JESD-30 Code :

S-PBGA-B900

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Product Status :

Obsolete

Organization :

25475 CLBS

Package / Case :

900-BBGA, FCBGA

JESD-609 Code :

e1

Number of Logic Elements/Cells :

326080

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Temperature Grade :

Industrial