XC7K325T-2FFG900C
- Mfr.Part #
- XC7K325T-2FFG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 980
- In Stock :
- 980
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 1V
- Series :
- Kintex®-7
- Base Part Number :
- XC7K325T
- Package / Case :
- 900-BBGA, FCBGA
- Operating Supply Voltage :
- 1V
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Speed Grade :
- -2
- Terminal Pitch :
- 1mm
- Pbfree Code :
- yes
- Number of Inputs :
- 500
- Number of Terminations :
- 900
- ECCN Code :
- 3A991.D
- Clock Frequency :
- 1818MHz
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Power Supplies :
- 11.83.3V
- Number of I/O :
- 500
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 11 Weeks
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-30 Code :
- S-PBGA-B900
- Total RAM Bits :
- 16404480
- Width :
- 31mm
- Voltage - Supply :
- 0.97V~1.03V
- Surface Mount :
- yes
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Number of Logic Elements/Cells :
- 326080
- Length :
- 31mm
- Operating Temperature :
- 0°C~85°C TJ
- JESD-609 Code :
- e1
- Published :
- 2009
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Pin Count :
- 900
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Reach Compliance Code :
- not_compliant
- Height Seated (Max) :
- 3.35mm
- Number of Registers :
- 407600
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RAM Size :
- 2MB
- Packaging :
- Tray
- Number of Outputs :
- 500
- Number of LABs/CLBs :
- 25475
- Datasheets
- XC7K325T-2FFG900C

FPGAs AMD Xilinx XC7K325T-2FFG900C Overview
The AMD Xilinx XC7K325T-2FFG900C is a highly capable FPGA (Field Programmable Gate Array) designed for advanced applications that require high-speed, reliable, and scalable solutions. This IC FPGA, housed in a 900FCBGA package, boasts an impressive 500 I/O, making it ideal for complex digital processing tasks in a multitude of industrial environments. As a standout product in the FPGA category, the AMD Xilinx XC7K325T-2FFG900C delivers unmatched performance and flexibility, ensuring that it can meet the demands of the most challenging systems and innovations.
XC7K325T-2FFG900C Features
This FPGA is equipped with multiple features that make it a powerful choice for developers and engineers looking to push the boundaries of technology. Key features include a robust 900-pin flip-chip ball grid array (FCBGA) packaging that ensures a reliable physical interface and excellent thermal characteristics. Additionally, the device supports various logic optimization techniques, high-speed DSP slices, and advanced security protocols, making it a versatile core component in any high-end electronic system.
XC7K325T-2FFG900C Applications
- Telecommunications: Utilized in communication infrastructure equipment, improving data throughput and signal processing capabilities.
- Automotive: Critical in driver assistance systems, where it processes real-time data from sensors and cameras.
- Consumer Electronics: Empowers high-performance consumer electronics, such as gaming consoles and smart TVs, enhancing processing speed and graphic capabilities.
- Industrial Automation: Serves as the processing core in industrial automation systems, facilitating complex control algorithms and real-time system monitoring.
- Aerospace and Defense: Deployed in aerospace systems for its ability to handle multiple data processing tasks simultaneously in a rugged environment.
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