XC7K325T-2FFG676I
- Mfr.Part #
- XC7K325T-2FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 990
- In Stock :
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Power Supplies :
- 11.83.3V
- Memory Size :
- 1GB
- Pin Count :
- 676
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 3.37mm
- Qualification Status :
- Not Qualified
- Width :
- 27mm
- ECCN Code :
- 3A991.D
- Length :
- 27mm
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Terminal Form :
- Ball
- Base Part Number :
- XC7K325T
- Speed Grade :
- -2
- Memory Type :
- DDR3
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Clock Frequency :
- 1818MHz
- Factory Lead Time :
- 11 Weeks
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 676
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Published :
- 2009
- RoHS Status :
- ROHS3 Compliant
- Number of Inputs :
- 400
- Total RAM Bits :
- 16404480
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 326080
- JESD-30 Code :
- S-PBGA-B676
- JESD-609 Code :
- e1
- Number of LABs/CLBs :
- 25475
- Package / Case :
- 676-BBGA, FCBGA
- Pbfree Code :
- yes
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Series :
- Kintex®-7
- Number of Outputs :
- 400
- Number of Registers :
- 407600
- Terminal Pitch :
- 1mm
- Reach Compliance Code :
- not_compliant
- Voltage - Supply :
- 0.97V~1.03V
- Number of I/O :
- 400
- Supply Voltage :
- 1V
- RAM Size :
- 2MB
- Surface Mount :
- yes
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XC7K325T-2FFG676I
FPGAs AMD Xilinx XC7K325T-2FFG676I Overview
The AMD Xilinx XC7K325T-2FFG676I represents a state-of-the-art FPGA (Field Programmable Gate Array) designed to meet the high demands of modern digital signal processing and high-speed communications. This product, crafted for robust performance and versatility, is encased in a 676-pin flip-chip ball grid array (FCBGA) package, making it ideal for a wide range of applications requiring a high I/O count and substantial logic capacity. The integration of advanced technologies ensures this FPGA can handle complex algorithms and multiple functionalities simultaneously, making it an indispensable component for developers aiming to accelerate product development and enhance system capabilities.
XC7K325T-2FFG676I Features
This FPGA is equipped with 400 I/O pins, providing ample connectivity for diverse applications, from computing to telecommunications. It features high-speed DSP slices for efficient data processing and supports various logic configurations, enabling users to optimize its setup according to specific project needs. The robust thermal and mechanical design of the 676FCBGA package ensures reliability and durability in harsh environments, further underscoring its suitability for sophisticated electronic systems.
XC7K325T-2FFG676I Applications
- Telecommunications Infrastructure: Utilized in base stations and network routers to manage signal processing tasks efficiently, ensuring faster data transmission and improved network reliability.
- Automotive Systems: Integrates into driver assistance systems, providing the necessary computing power to process real-time data from sensors, aiding in decision-making processes and enhancing vehicle safety.
- Medical Imaging Equipment: Key component in MRI and ultrasound scanners, where its ability to rapidly process large volumes of data contributes to clearer, more accurate diagnostic images.
- Data Centers: Deployed in server farms for acceleration hardware, optimizing data handling, and storage processes, thereby increasing the throughput and efficiency of cloud services.
- Aerospace and Defense: Used in satellite communications and avionics systems, offering the robustness needed for critical applications that require high reliability and error-free operation in extreme conditions.
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