XC7K325T-2FFG676I

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Mfr.Part #
XC7K325T-2FFG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
990
In Stock :
990

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Power Supplies :
11.83.3V
Memory Size :
1GB
Pin Count :
676
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Height Seated (Max) :
3.37mm
Qualification Status :
Not Qualified
Width :
27mm
ECCN Code :
3A991.D
Length :
27mm
Combinatorial Delay of a CLB-Max :
0.61 ns
Terminal Form :
Ball
Base Part Number :
XC7K325T
Speed Grade :
-2
Memory Type :
DDR3
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Clock Frequency :
1818MHz
Factory Lead Time :
11 Weeks
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Terminations :
676
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Published :
2009
RoHS Status :
ROHS3 Compliant
Number of Inputs :
400
Total RAM Bits :
16404480
Terminal Position :
BOTTOM
Packaging :
Tray
Number of Logic Elements/Cells :
326080
JESD-30 Code :
S-PBGA-B676
JESD-609 Code :
e1
Number of LABs/CLBs :
25475
Package / Case :
676-BBGA, FCBGA
Pbfree Code :
yes
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Series :
Kintex®-7
Number of Outputs :
400
Number of Registers :
407600
Terminal Pitch :
1mm
Reach Compliance Code :
not_compliant
Voltage - Supply :
0.97V~1.03V
Number of I/O :
400
Supply Voltage :
1V
RAM Size :
2MB
Surface Mount :
yes
Operating Temperature :
-40°C~100°C TJ
Datasheets
XC7K325T-2FFG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-2FFG676I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:XC7K325T, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XC7K325T-2FFG676I pinout, XC7K325T-2FFG676I datasheet PDF, XC7K325T-2FFG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-2FFG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7K325T-2FFG676I


FPGAs AMD Xilinx XC7K325T-2FFG676I Overview

The AMD Xilinx XC7K325T-2FFG676I represents a state-of-the-art FPGA (Field Programmable Gate Array) designed to meet the high demands of modern digital signal processing and high-speed communications. This product, crafted for robust performance and versatility, is encased in a 676-pin flip-chip ball grid array (FCBGA) package, making it ideal for a wide range of applications requiring a high I/O count and substantial logic capacity. The integration of advanced technologies ensures this FPGA can handle complex algorithms and multiple functionalities simultaneously, making it an indispensable component for developers aiming to accelerate product development and enhance system capabilities.

XC7K325T-2FFG676I Features

This FPGA is equipped with 400 I/O pins, providing ample connectivity for diverse applications, from computing to telecommunications. It features high-speed DSP slices for efficient data processing and supports various logic configurations, enabling users to optimize its setup according to specific project needs. The robust thermal and mechanical design of the 676FCBGA package ensures reliability and durability in harsh environments, further underscoring its suitability for sophisticated electronic systems.

XC7K325T-2FFG676I Applications

  • Telecommunications Infrastructure: Utilized in base stations and network routers to manage signal processing tasks efficiently, ensuring faster data transmission and improved network reliability.
  • Automotive Systems: Integrates into driver assistance systems, providing the necessary computing power to process real-time data from sensors, aiding in decision-making processes and enhancing vehicle safety.
  • Medical Imaging Equipment: Key component in MRI and ultrasound scanners, where its ability to rapidly process large volumes of data contributes to clearer, more accurate diagnostic images.
  • Data Centers: Deployed in server farms for acceleration hardware, optimizing data handling, and storage processes, thereby increasing the throughput and efficiency of cloud services.
  • Aerospace and Defense: Used in satellite communications and avionics systems, offering the robustness needed for critical applications that require high reliability and error-free operation in extreme conditions.
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