XC7K325T-2FF900I
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- Mfr.Part #
- XC7K325T-2FF900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 2
- In Stock ：
- 2
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Memory Size :
- 1GB
- Width :
- 31mm
- Clock Frequency :
- 1818MHz
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Turn On Delay Time :
- 100 ps
- Packaging :
- Tray
- Radiation Hardening :
- No
- RAM Size :
- 2MB
- Package / Case :
- 900-BBGA, FCBGA
- Terminal Form :
- Ball
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Series :
- Kintex®-7
- Length :
- 31mm
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Published :
- 2009
- Voltage - Supply :
- 0.97V~1.03V
- Number of Terminations :
- 900
- Number of Logic Elements/Cells :
- 326080
- Memory Type :
- DDR3
- Total RAM Bits :
- 16404480
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 500
- Number of Registers :
- 407600
- Power Supplies :
- 11.83.3V
- Height Seated (Max) :
- 3.35mm
- Number of LABs/CLBs :
- 25475
- Number of I/O :
- 500
- Operating Temperature :
- -40°C~100°C TJ
- Propagation Delay :
- 100 ps
- Supply Voltage :
- 1V
- Base Part Number :
- XC7K325T
- Number of Pins :
- 900
- RoHS Status :
- Non-RoHS Compliant
- Factory Lead Time :
- 11 Weeks
- Speed Grade :
- 2
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Contact Plating :
- Lead, Tin
- Terminal Pitch :
- 1mm
- Datasheets
- XC7K325T-2FF900I
FPGAs AMD Xilinx XC7K325T-2FF900I Overview
The AMD Xilinx XC7K325T-2FF900I, part of the versatile Kintex-7 family, exemplifies state-of-the-art FPGA technology with enhanced performance suitable for high-end applications. This device integrates robust adaptability with substantial logic density, making it a prime choice for developers looking to implement complex digital circuits with shorter time-to-market. The FPGA boasts a flexible architecture that supports a wide range of applications, from digital signal processing to high-speed networking. Its high I/O count and compact 900FCBGA packaging make it ideal for dense and efficient board designs, ensuring a blend of power and functionality that meets contemporary engineering demands.
XC7K325T-2FF900I Features
This FPGA features 500 user I/Os, which facilitate extensive interfacing with other digital systems and peripherals, enhancing its adaptability in complex multi-component setups. The device is built on a 28nm process, offering an optimal balance of power, performance, and cost. Its high-speed transceiver lines and advanced DSP slices provide the capability to handle intricate signal processing tasks and data-intensive operations efficiently. Moreover, the robust security features and high reliability of the XC7K325T-2FF900I make it an excellent choice for critical applications where data integrity and operational stability are paramount.
XC7K325T-2FF900I Applications
- Telecommunications: Used in high-speed network devices and infrastructure, enabling rapid data transmission and reliable connectivity crucial for modern telecom services.
- Data Centers: Integral in managing complex data processing tasks, contributing to increased efficiency in data storage and retrieval operations in large-scale server environments.
- Aerospace and Defense: Deployed in avionics and military hardware for signal and image processing, enhancing mission-critical systems' performance and reliability.
- Medical Imaging: Helps in the development of advanced diagnostic tools, such as MRI and CT scanners, by processing complex algorithms required for high-resolution images.
- Automotive: Utilized in driver assistance systems (ADAS) to process real-time sensory data, aiding in safer and smarter vehicle functionalities.
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