XC7K325T-2FF676I

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Mfr.Part #
XC7K325T-2FF676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
1,004
In Stock :
1,004

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
3.37mm
RoHS Status :
Non-RoHS Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Power Supplies :
11.83.3V
Terminal Form :
Ball
Number of Terminations :
676
Number of I/O :
400
Combinatorial Delay of a CLB-Max :
0.61 ns
Contact Plating :
Lead, Tin
Memory Type :
DDR3
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
326080
Operating Temperature :
-40°C~100°C TJ
Mount :
Surface Mount
Series :
Kintex®-7
Number of Inputs :
400
Package / Case :
676-BBGA, FCBGA
Memory Size :
1GB
Number of Outputs :
400
RAM Size :
2MB
Mounting Type :
Surface Mount
Published :
2010
Packaging :
Tray
Factory Lead Time :
11 Weeks
Supply Voltage :
1V
Total RAM Bits :
16404480
Voltage - Supply :
0.97V~1.03V
Number of LABs/CLBs :
25475
Base Part Number :
XC7K325T
Speed Grade :
2
Turn On Delay Time :
100 ps
Radiation Hardening :
No
Propagation Delay :
100 ps
Number of Registers :
407600
JESD-30 Code :
S-PBGA-B676
Clock Frequency :
1818MHz
Datasheets
XC7K325T-2FF676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-2FF676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Operating Temperature:-40°C~100°C TJ, Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:XC7K325T, XC7K325T-2FF676I pinout, XC7K325T-2FF676I datasheet PDF, XC7K325T-2FF676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-2FF676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7K325T-2FF676I


FPGAs AMD Xilinx XC7K325T-2FF676I Overview

The FPGAs AMD Xilinx XC7K325T-2FF676I is a highly advanced integrated circuit specifically designed for applications that require high performance, flexibility, and increased I/O capabilities. Manufactured by AMD Xilinx, a leader in digital design and fabrication, this FPGA features a robust architecture housed in a 676-pin FCBGA (Flip-Chip Ball Grid Array) package, ensuring efficient thermal management and space-saving on PCBs. It supports a wide array of configurations and is particularly well-suited for demanding applications that require rapid prototyping and scalable solutions. Utilizing this cutting-edge technology, enterprises can significantly accelerate their development cycles and enhance system performance.

XC7K325T-2FF676I Features

This FPGA model boasts 400 I/O ports, offering ample connectivity options for various digital and analog inputs and outputs. With its high integration capacity, the XC7K325T-2FF676I supports a multitude of logic operations, facilitating complex circuit designs and system level integrations directly onto a single chip. The chip's advanced technology also ensures lower power consumption and higher data processing speeds, making it an optimal choice for energy-sensitive projects requiring intensive data computation.

XC7K325T-2FF676I Applications

  • Telecommunications: Used in communication infrastructure to manage signal processing and data flow efficiently.
  • Automotive: Ideal for driver assistance systems where rapid signal processing is crucial.
  • Consumer Electronics: Can be integrated into high-performance home electronics, enhancing functionality and interactivity.
  • Industrial Automation: Helps in controlling machinery and processes with high precision and reliability.
  • Aerospace and Defense: Suitable for applications requiring high levels of data security and operational integrity.
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