XC7K325T-2FBG900I

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Memory Size :

1GB

Combinatorial Delay of a CLB-Max :

0.61 ns

Terminal Pitch :

1mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

RoHS Status :

ROHS3 Compliant

Terminal Form :

Ball

Number of Logic Elements/Cells :

326080

Pin Count :

900

Number of LABs/CLBs :

25475

Pbfree Code :

yes

Reach Compliance Code :

not_compliant

HTS Code :

8542.39.00.01

Supply Voltage :

1V

Qualification Status :

Not Qualified

Length :

31mm

Factory Lead Time :

11 Weeks

Number of Terminations :

900

Published :

2009

Moisture Sensitivity Level (MSL) :

4 (72 Hours)

Voltage - Supply :

0.97V~1.03V

ECCN Code :

3A991.D

Height Seated (Max) :

2.54mm

Width :

31mm

Packaging :

Tray

Number of I/O :

500

Total RAM Bits :

16404480

Number of Registers :

407600

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Package / Case :

900-BBGA, FCBGA

Contact Plating :

Copper, Silver, Tin

Power Supplies :

11.83.3V

Surface Mount :

yes

RAM Size :

2MB

Clock Frequency :

1818MHz

Speed Grade :

-2

Memory Type :

DDR3

Terminal Position :

BOTTOM

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Mounting Type :

Surface Mount

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Number of Outputs :

500

Operating Temperature :

-40°C~100°C TJ

Base Part Number :

XC7K325T

JESD-609 Code :

e1

Series :

Kintex®-7

Number of Pins :

900