XC7K325T-2FBG676I
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- Mfr.Part #
- XC7K325T-2FBG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 4,646
- In Stock ：
- 4,646
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 2009
- Number of Pins :
- 676
- Number of Registers :
- 407600
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Number of I/O :
- 400
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Contact Plating :
- Copper, Silver, Tin
- Height Seated (Max) :
- 2.54mm
- Memory Type :
- DDR3
- Total RAM Bits :
- 16404480
- Width :
- 27mm
- Number of Terminations :
- 676
- Base Part Number :
- XC7K325T
- Pbfree Code :
- yes
- Number of Logic Elements/Cells :
- 326080
- RoHS Status :
- ROHS3 Compliant
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Clock Frequency :
- 1818MHz
- Memory Size :
- 1GB
- RAM Size :
- 2MB
- Package / Case :
- 676-BBGA, FCBGA
- Terminal Position :
- BOTTOM
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Packaging :
- Tray
- HTS Code :
- 8542.39.00.01
- Pin Count :
- 676
- Voltage - Supply :
- 0.97V~1.03V
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Power Supplies :
- 11.83.3V
- Number of LABs/CLBs :
- 25475
- Series :
- Kintex®-7
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 400
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- ECCN Code :
- 3A991.D
- JESD-609 Code :
- e1
- Speed Grade :
- -2
- Supply Voltage :
- 1V
- Length :
- 27mm
- Factory Lead Time :
- 11 Weeks
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Datasheets
- XC7K325T-2FBG676I
FPGAs AMD Xilinx XC7K325T-2FBG676I Overview
The AMD Xilinx XC7K325T-2FBG676I is a high-performance FPGA (Field Programmable Gate Array) designed to meet the demanding needs of modern digital applications. As a part of the Kintex-7 family, this IC offers a robust blend of performance, power efficiency, and cost-effectiveness, making it an ideal choice for a wide range of industrial applications. This FPGA is equipped with 400 I/O options and is packaged in a 676-pin flip-chip ball grid array (FCBGA), ensuring ample flexibility and connectivity for complex designs. The FPGAs AMD Xilinx XC7K325T-2FBG676I is tailored for designers who require significant logic density and I/O bandwidth while managing power consumption and cost.
XC7K325T-2FBG676I Features
- High Logic Density: Enables the integration of numerous functions on a single chip, reducing the overall system cost and complexity.
- Advanced I/O Capabilities: Provides up to 400 I/O pins to facilitate complex, multi-faceted designs and interfaces.
- Power Efficiency: Optimized for low power consumption, enhancing the sustainability of the device and reducing operating costs.
- 676-pin FCBGA Packaging: Offers robust packaging that ensures reliability and performance in harsh environments.
- Flexible Configuration Options: Supports a range of configuration schemes, including JTAG, SPI, and parallel, for versatile use in different system architectures.
XC7K325T-2FBG676I Applications
- Telecommunications: Utilized in routing and switching systems to handle the complexities of signal and data processing tasks required in modern communication infrastructures.
- Automotive Electronics: Integrated into driver assistance systems to process real-time sensor data and support safety-critical functions.
- Industrial Automation: Drives complex machinery control systems in manufacturing environments, enhancing operational efficiency and reliability.
- Medical Devices: Used in medical imaging systems like MRI and ultrasound devices, ensuring high-speed data processing capabilities essential for detailed imaging.
- Consumer Electronics: Employs in devices such as high-definition multimedia interfaces and smart home appliances, providing necessary processing power for enhanced user experiences.
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