XC7K325T-2FBG676C
- Mfr.Part #
- XC7K325T-2FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 859
- In Stock :
- 859
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- Published :
- 2010
- Series :
- Kintex®-7
- Number of Logic Elements/Cells :
- 326080
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e1
- Qualification Status :
- Not Qualified
- Base Part Number :
- XC7K325T
- Number of Registers :
- 407600
- Contact Plating :
- Copper, Silver, Tin
- Voltage - Supply :
- 0.97V~1.03V
- Memory Type :
- DDR3
- Length :
- 27mm
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 400
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Supply Voltage :
- 1V
- Power Supplies :
- 11.83.3V
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Terminations :
- 676
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 1818MHz
- Pin Count :
- 676
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Operating Temperature :
- 0°C~85°C TJ
- Total RAM Bits :
- 16404480
- RAM Size :
- 2MB
- Number of Pins :
- 676
- ECCN Code :
- 3A991.D
- Memory Size :
- 1GB
- Number of I/O :
- 400
- Speed Grade :
- -2
- Factory Lead Time :
- 11 Weeks
- Height Seated (Max) :
- 2.54mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of LABs/CLBs :
- 25475
- Width :
- 27mm
- Package / Case :
- 676-BBGA, FCBGA
- Terminal Position :
- BOTTOM
- Surface Mount :
- yes
- Pbfree Code :
- yes
- Datasheets
- XC7K325T-2FBG676C
FPGAs AMD Xilinx XC7K325T-2FBG676C Overview
The AMD Xilinx XC7K325T-2FBG676C is a cutting-edge Field Programmable Gate Array (FPGA) designed for versatility and high-performance applications across various industries. This FPGA is housed in a 676-pin flip-chip ball grid array (FCBGA) package, which supports robust physical integration into multiple device architectures. Known for its flexibility in programming and configuration, this device enables developers to customize functionalities to meet specific system requirements, dramatically reducing time to market and enhancing system reliability. The robust I/O capabilities, combined with advanced processing features, make it an ideal choice for handling complex digital computations and signal processing tasks.
XC7K325T-2FBG676C Features
The XC7K325T-2FBG676C from AMD Xilinx comes equipped with 400 I/O pins, offering extensive connectivity options and flexibility for various system designs. This FPGA boasts high-speed DSP slices, ample logic cells, and integrated memory controllers, which are essential for high-throughput applications that require rapid data processing and storage. Its advanced clock management features and power efficiency optimizations further enhance its performance for demanding applications.
XC7K325T-2FBG676C Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, this FPGA optimizes computations like encryption and traffic management.
- Medical Imaging: Capable of processing complex algorithms required for real-time image processing, thus improving the clarity and speed of medical diagnostics.
- Telecommunications: Used in network infrastructure to handle signal processing and data packet routing, enhancing bandwidth efficiency and communication reliability.
- Aerospace: Serves in satellite communications for processing onboard data and controlling communication links, ensuring robust and reliable data transmissions.
- Automotive: Integrated into advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras, helping in real-time decision making and vehicle safety enhancements.
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