XC7K325T-1FFV900I

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Mfr.Part #
XC7K325T-1FFV900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 500 I/O 900FCBGA
Stock
30,339
In Stock :
30,339

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Combinatorial Delay of a CLB-Max :
0.74 ns
Total RAM Bits :
16404480
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
Number of LABs/CLBs :
25475
Number of Registers :
407600
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Height Seated (Max) :
3.35mm
Mount :
Surface Mount
Mounting Type :
Surface Mount
Voltage - Supply :
0.97V~1.03V
Published :
2009
RAM Size :
2MB
Package / Case :
900-BBGA, FCBGA
Contact Plating :
Copper, Silver, Tin
Number of I/O :
500
Series :
Kintex®-7
Number of Terminations :
900
Packaging :
Bulk
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
326080
RoHS Status :
ROHS3 Compliant
Memory Size :
1GB
Supply Voltage :
1V
JESD-30 Code :
S-PBGA-B900
Operating Temperature :
-40°C~100°C TJ
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Memory Type :
DDR3
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed Grade :
1
Terminal Form :
Ball
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Datasheets
XC7K325T-1FFV900I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-1FFV900I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:900-BBGA, FCBGA, Number of Terminations:900, Operating Temperature:-40°C~100°C TJ, XC7K325T-1FFV900I pinout, XC7K325T-1FFV900I datasheet PDF, XC7K325T-1FFV900I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-1FFV900I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7K325T-1FFV900I


FPGAs AMD Xilinx XC7K325T-1FFV900I Overview

The FPGAs AMD Xilinx XC7K325T-1FFV900I is a high-performance field-programmable gate array designed to meet the rigorous demands of modern digital applications. This component, fabricated by the renowned AMD Xilinx, stands out due to its versatility and high capacity, encapsulated in a 900FCBGA (Fine Pitch Ball Grid Array) package. It is particularly tailored for advanced systems requiring substantial logic and I/O interfacing capabilities, with its 500 I/O options facilitating diverse and flexible connection possibilities. This FPGA is ideal for developers aiming to rapidly deploy high-speed and complex logic designs while ensuring reliability and efficiency in high-stakes environments.

XC7K325T-1FFV900I Features

The XC7K325T-1FFV900I FPGA boasts a range of features that enhance its utility in demanding applications. These include advanced high-speed transceiver links, ample logic cells, and a robust clock management system. Its superior signal integrity and low-latency communication are pivotal for real-time applications. Additionally, the FPGA supports a wide range of voltage inputs and temperature ranges, making it highly adaptable to various operational environments.

XC7K325T-1FFV900I Applications

  • Telecommunications Equipment: Used in routers and switches to manage data traffic efficiently and reliably.
  • Automotive Systems: Integrates into driver assistance systems to process real-time data from sensors and cameras.
  • Medical Imaging: Crucial in the processing and real-time analysis of complex imaging data in medical diagnostics equipment.
  • Data Centers: Serves as a core component in storage and server solutions, enhancing data processing capabilities and network management.
  • Industrial Automation: Helps in the control systems of automated production lines, improving precision and operational efficiency.
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