XC7K325T-1FFG676I
- Mfr.Part #
- XC7K325T-1FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 490
- In Stock :
- 490
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Inputs :
- 400
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- RAM Size :
- 2MB
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Speed Grade :
- -1
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 400
- Pbfree Code :
- yes
- ECCN Code :
- 3A991.D
- Supply Voltage :
- 1V
- Power Supplies :
- 11.83.3V
- Base Part Number :
- XC7K325T
- JESD-30 Code :
- S-PBGA-B676
- Memory Type :
- DDR3
- Series :
- Kintex®-7
- Number of Logic Elements/Cells :
- 326080
- Terminal Pitch :
- 1mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-609 Code :
- e1
- Number of LABs/CLBs :
- 25475
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Number of Outputs :
- 400
- Number of Registers :
- 407600
- Reach Compliance Code :
- not_compliant
- Package / Case :
- 676-BBGA, FCBGA
- Published :
- 2009
- Memory Size :
- 1GB
- Terminal Form :
- Ball
- Clock Frequency :
- 1098MHz
- Qualification Status :
- Not Qualified
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Length :
- 27mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Total RAM Bits :
- 16404480
- Pin Count :
- 676
- Voltage - Supply :
- 0.97V~1.03V
- Operating Temperature :
- -40°C~100°C TJ
- Height Seated (Max) :
- 3.37mm
- Number of Terminations :
- 676
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- Factory Lead Time :
- 11 Weeks
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- RoHS Status :
- ROHS3 Compliant
- Width :
- 27mm
- Datasheets
- XC7K325T-1FFG676I
FPGAs AMD Xilinx XC7K325T-1FFG676I Overview
The AMD Xilinx XC7K325T-1FFG676I represents a high-performance addition to the field of field programmable gate arrays (FPGAs). Designed to deliver exceptional flexibility and efficiency, this IC FPGA is housed in a 676-pin flip-chip ball grid array (FCBGA) package, supporting a broad spectrum of functionalities and advanced integration. Its capabilities make it ideal for applications that require high-speed data processing and significant logic density. This specific model is well-suited for demanding environments and applications, featuring a robust design that ensures reliability and performance under a range of conditions.
XC7K325T-1FFG676I Features
The XC7K325T-1FFG676I FPGA by AMD Xilinx is designed to cater to complex digital computations, providing 400 I/O options for versatile connectivity and integration. The device supports a range of voltage inputs and offers low power consumption, which is critical for sustainable, high-performance operations in industrial applications. The FPGA's architecture allows for efficient logic distribution, making it a powerful solution for developing high-speed digital interfaces and embedded systems.
XC7K325T-1FFG676I Applications
- Data Centers: Utilized in server management and data processing tasks, ensuring high-speed data handling and increased reliability for cloud computing infrastructures.
- Telecommunications: Plays a critical role in signal processing and network infrastructure, enhancing the performance and efficiency of communication systems.
- Automotive: Applied in driver assistance systems and infotainment systems, offering robust processing capabilities that contribute to safer and more enjoyable driving experiences.
- Medical Devices: Used in medical imaging systems and diagnostic equipment, providing the necessary speed and accuracy for high-resolution imaging and real-time data processing.
- Industrial Automation: Integral to the control systems in manufacturing processes, improving operational efficiency and precision in robotics and assembly lines.
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