XC7K325T-1FFG676C
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- Mfr.Part #
- XC7K325T-1FFG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RAM Size :
- 2MB
- ECCN Code :
- 3A991.D
- Power Supplies :
- 11.83.3V
- Supply Voltage :
- 1V
- Height Seated (Max) :
- 3.37mm
- Surface Mount :
- yes
- HTS Code :
- 8542.39.00.01
- Base Part Number :
- XC7K325T
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of LABs/CLBs :
- 25475
- Operating Temperature :
- 0°C~85°C TJ
- Number of Terminations :
- 676
- Factory Lead Time :
- 11 Weeks
- Series :
- Kintex®-7
- Memory Size :
- 1GB
- Width :
- 27mm
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 676-BBGA, FCBGA
- Clock Frequency :
- 1098MHz
- Pin Count :
- 676
- Published :
- 2009
- Number of Logic Elements/Cells :
- 326080
- Contact Plating :
- Copper, Silver, Tin
- Pbfree Code :
- yes
- Voltage - Supply :
- 0.97V~1.03V
- Memory Type :
- DDR3
- Reach Compliance Code :
- not_compliant
- Number of Outputs :
- 400
- Length :
- 27mm
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Total RAM Bits :
- 16404480
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- RoHS Status :
- ROHS3 Compliant
- Speed Grade :
- -1
- Number of Registers :
- 407600
- JESD-609 Code :
- e1
- Number of Pins :
- 676
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 400
- Datasheets
- XC7K325T-1FFG676C
FPGAs AMD Xilinx XC7K325T-1FFG676C Overview
The AMD Xilinx XC7K325T-1FFG676C, part of the advanced Kintex-7 family, stands out in the FPGA (Field Programmable Gate Array) market with its robust feature set designed for high-performance applications requiring efficient logic utilization and power effectiveness. This IC FPGA integrates 400 I/Os within a 676-pin flip-chip BGA package, making it ideal for complex digital computations and signal processing tasks. Its scalability and adaptability make it an optimal choice for designers aiming to enhance system performance and reliability in various demanding environments.
XC7K325T-1FFG676C Features
The XC7K325T-1FFG676C FPGA from AMD Xilinx offers a comprehensive range of features including high logic capacity, increased I/O bandwidth, and low power consumption. It supports advanced DSP (Digital Signal Processing) slices for optimized arithmetic functions and integrated transceivers to facilitate high-speed communication. The device is also equipped with a high-speed memory controller and multiple clock management features, enhancing its efficiency in multi-core processing and real-time data handling.
XC7K325T-1FFG676C Applications
- Data Centers: Utilized for accelerating compute-intensive applications such as real-time data analysis and virtualization, enhancing server efficiency and performance.
- Medical Imaging: Applies its high processing power to facilitate rapid and accurate image processing in devices like MRI and CT scanners, improving diagnostic capabilities.
- Telecommunications: Employed in network infrastructure to manage and optimize data flow, ensuring faster and more reliable data transmission across networks.
- Aerospace: Used in avionics for flight control systems and onboard data handling, ensuring robust performance in critical environments.
- Automotive: Integral in driver assistance systems and infotainment systems, providing both enhanced safety and a better user experience.
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