XC7K325T-1FB900I
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- Mfr.Part #
- XC7K325T-1FB900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 34,993
- In Stock ：
- 34,993
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Turn On Delay Time :
- 120 ps
- Max Operating Temperature :
- 100°C
- Package / Case :
- 900-BBGA, FCBGA
- Number of Registers :
- 407600
- Voltage - Supply :
- 0.97V~1.03V
- Min Operating Temperature :
- -40°C
- Mount :
- Surface Mount
- Radiation Hardening :
- No
- Series :
- Kintex®-7
- Packaging :
- Tray
- Speed Grade :
- 1
- Supplier Device Package :
- 900-FCBGA (31x31)
- Number of Logic Blocks (LABs) :
- 25475
- Memory Type :
- DDR3
- Factory Lead Time :
- 11 Weeks
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Base Part Number :
- XC7K325T
- Number of Logic Elements/Cells :
- 326080
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 16404480
- Contact Plating :
- Lead, Tin
- Memory Size :
- 1GB
- Published :
- 2009
- Max Supply Voltage :
- 1.03V
- RAM Size :
- 2MB
- RoHS Status :
- Non-RoHS Compliant
- Number of Pins :
- 900
- Number of I/O :
- 500
- Propagation Delay :
- 120 ps
- Operating Temperature :
- -40°C~100°C TJ
- Min Supply Voltage :
- 970mV
- Number of LABs/CLBs :
- 25475
- Datasheets
- XC7K325T-1FB900I
FPGAs AMD Xilinx XC7K325T-1FB900I Overview
The FPGAs AMD Xilinx XC7K325T-1FB900I is a high-performance Field Programmable Gate Array (FPGA) designed for advanced systems requiring high-speed data processing and significant logic integration. This FPGA is well-suited for developers looking to harness the power of a programmable logic device that combines both high I/O capacity and a dense configuration of logic cells. It provides a robust platform for developing complex digital computing tasks and is particularly effective in environments demanding reliability and adaptability.
XC7K325T-1FB900I Features
The XC7K325T-1FB900I FPGA from AMD Xilinx offers a range of features making it an excellent choice for various applications. Key features include:
- 900-pin FCBGA (Flip-Chip Ball Grid Array) package, ensuring durable and reliable connections.
- 500 user I/Os, providing extensive interfacing capabilities.
- High-performance logic integration suitable for complex digital processing.
XC7K325T-1FB900I Applications
- Data Centers: Ideal for managing and accelerating data processing tasks, improving efficiency and reducing latency in networked environments.
- Telecommunications: Can be used in infrastructure for signal processing, network management, and communications protocol implementations.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors and cameras in real-time.
- Video Surveillance: Capable of handling high-definition video processing and real-time image analytics for security systems.
- Medical Imaging: Useful in devices requiring quick processing of complex imaging data, such as MRI and CT scanners.
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