XC7K325T-1FB676I
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- Mfr.Part #
- XC7K325T-1FB676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 1,303
- In Stock ：
- 1,303
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 2009
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- -40°C~100°C TJ
- Mount :
- Surface Mount
- Factory Lead Time :
- 16 Weeks
- Number of Inputs :
- 400
- Number of Logic Elements/Cells :
- 326080
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 676-BBGA, FCBGA
- Radiation Hardening :
- No
- Propagation Delay :
- 120 ps
- Packaging :
- Tray
- Operating Supply Voltage :
- 1V
- Terminal Form :
- Ball
- Number of Terminations :
- 676
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of LABs/CLBs :
- 25475
- Mounting Type :
- Surface Mount
- Number of Registers :
- 407600
- RAM Size :
- 2MB
- Base Part Number :
- XC7K325T
- Number of Outputs :
- 400
- Total RAM Bits :
- 16404480
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e0
- Voltage - Supply :
- 0.97V~1.03V
- Series :
- Kintex®-7
- Number of I/O :
- 400
- Speed Grade :
- 1
- JESD-30 Code :
- S-PBGA-B676
- Datasheets
- XC7K325T-1FB676I
FPGAs AMD Xilinx XC7K325T-1FB676I Overview
The FPGAs AMD Xilinx XC7K325T-1FB676I is a high-performance field-programmable gate array designed for advanced applications that require substantial logic, high-speed I/O, and superior signal processing capabilities. This FPGA is integrated into a 676-pin flip-chip ball grid array (FCBGA) package, making it ideal for dense and compact hardware designs. With its robust architecture and flexibility, the XC7K325T-1FB676I is tailored for developers aiming to push the boundaries of technological innovation, offering them a platform that combines versatility with performance efficiency.
XC7K325T-1FB676I Features
The XC7K325T-1FB676I FPGA from AMD Xilinx is equipped with a multitude of features that make it a top choice for demanding applications. It houses 400 I/O pins, allowing extensive connectivity and interfacing options. The high I/O count is perfect for complex digital systems requiring numerous connections, such as high-speed networking devices and advanced computing systems. Its integration in a 676FCBGA package ensures that despite its vast capabilities, the physical footprint remains minimized.
XC7K325T-1FB676I Applications
- Data Centers: Utilized for managing high-speed data operations and storage solutions, enhancing data throughput and reliability in server environments.
- Telecommunications: Employs its extensive I/O capabilities to facilitate rapid signal processing tasks required in modern communication infrastructures, such as base stations and network switches.
- Medical Imaging: Ideal for handling the complex data processing needed in medical imaging equipment, improving both image quality and processing speed.
- Automotive: Applied in advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras, enhancing vehicle safety and performance.
- Aerospace: Supports the rigorous demands of aerospace applications, including navigation and control systems, where high-level data processing and reliability are critical.
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