XC7K325T-1FB676C

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Mfr.Part #
XC7K325T-1FB676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
37,401
In Stock :
37,401

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Speed Grade :
1
Terminal Finish :
Tin/Lead (Sn63Pb37)
Propagation Delay :
120 ps
Terminal Form :
Ball
Operating Supply Voltage :
1V
JESD-609 Code :
e0
Published :
2009
Number of Registers :
407600
Number of Logic Elements/Cells :
326080
Voltage - Supply :
0.97V~1.03V
Terminal Position :
BOTTOM
JESD-30 Code :
S-PBGA-B676
Radiation Hardening :
No
RAM Size :
2MB
Mounting Type :
Surface Mount
Number of LABs/CLBs :
25475
Number of Outputs :
400
Package / Case :
676-BBGA, FCBGA
Factory Lead Time :
16 Weeks
Number of I/O :
400
Number of Inputs :
400
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Mount :
Surface Mount
Series :
Kintex®-7
Operating Temperature :
0°C~85°C TJ
Base Part Number :
XC7K325T
Total RAM Bits :
16404480
Number of Terminations :
676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Datasheets
XC7K325T-1FB676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-1FB676C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Base Part Number:XC7K325T, Number of Terminations:676, XC7K325T-1FB676C pinout, XC7K325T-1FB676C datasheet PDF, XC7K325T-1FB676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K325T-1FB676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7K325T-1FB676C


FPGAs AMD Xilinx XC7K325T-1FB676C Overview

The FPGAs AMD Xilinx XC7K325T-1FB676C is a highly versatile and powerful integrated circuit designed by AMD Xilinx, tailored for applications requiring high-speed data processing and flexible hardware configuration. This FPGA is housed in a 676-pin FCBGA (Flip-Chip Ball Grid Array) package, supporting up to 400 I/O options, which makes it exceptionally suitable for complex digital circuits and multi-functional systems. The use of advanced technology in XC7K325T-1FB676C allows for improved heat dissipation and reduced power consumption, making it a prime choice for engineers looking for robust performance in high-demand environments.

XC7K325T-1FB676C Features

The XC7K325T-1FB676C FPGA from AMD Xilinx offers extensive features that enhance its utility in a wide range of applications. Key features include a high I/O count that is crucial for comprehensive system designs, superior signal integrity provided by the FCBGA package, and adaptive logic that can be programmed to meet specific user needs. Additionally, this FPGA supports various logic optimization techniques, which aid in maximizing performance while minimizing power usage.

XC7K325T-1FB676C Applications

  • Data Centers: Utilized in managing data traffic and processing tasks efficiently, enhancing server capabilities and storage solutions.
  • Telecommunication Infrastructure: Integral for developing components such as high-speed switches and routers, which are essential for network management and expansion.
  • Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, ensuring improved safety and vehicle dynamics.
  • Medical Equipment: Essential in the development of medical imaging systems like MRI and ultrasound machines, aiding in complex data analysis and real-time results.
  • Industrial Automation: Used in the automation of machinery and processes, improving efficiency and precision in manufacturing and other industrial sectors.
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