XC6SLX9-N3FT256I

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Mfr.Part #
XC6SLX9-N3FT256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 186 I/O 256FTBGA
Stock
19,319
In Stock :
19,319

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Combinatorial Delay of a CLB-Max :
0.26 ns
Height Seated (Max) :
1.55mm
Base Part Number :
XC6SLX9
Peak Reflow Temperature (Cel) :
240
Voltage - Supply :
1.14V~1.26V
Width :
17mm
Series :
Spartan®-6 LX
Mounting Type :
Surface Mount
Total RAM Bits :
589824
Supply Voltage :
1.2V
Operating Temperature :
-40°C~100°C TJ
Package / Case :
256-LBGA
JESD-30 Code :
S-PBGA-B256
Length :
17mm
Number of Terminations :
256
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of CLBs :
715
JESD-609 Code :
e0
Published :
2008
ECCN Code :
EAR99
Terminal Form :
Ball
Number of I/O :
186
Packaging :
Tray
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Position :
BOTTOM
Power Supplies :
1.21.2/3.32.5/3.3V
Reach Compliance Code :
not_compliant
Number of Outputs :
186
Qualification Status :
Not Qualified
Surface Mount :
yes
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Pitch :
1mm
Number of Inputs :
186
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
806MHz
RoHS Status :
Non-RoHS Compliant
Number of Logic Elements/Cells :
9152
Number of LABs/CLBs :
715
Datasheets
XC6SLX9-N3FT256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX9-N3FT256I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC6SLX9, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:256-LBGA, Number of Terminations:256, XC6SLX9-N3FT256I pinout, XC6SLX9-N3FT256I datasheet PDF, XC6SLX9-N3FT256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX9-N3FT256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX9-N3FT256I


FPGAs AMD Xilinx XC6SLX9-N3FT256I Overview

The AMD Xilinx XC6SLX9-N3FT256I is a high-performance, field-programmable gate array designed to meet the intensive demands of modern digital circuits. This FPGA is housed in a 256-pin FTBGA package and provides a robust platform for developing varied applications, thanks to its versatile 186 I/O pins and optimized architecture. Whether you're designing for demanding industrial applications or advanced communication systems, the FPGAs AMD Xilinx XC6SLX9-N3FT256I offers the flexibility and scalability needed to create high-functionality, reliable digital products. This component is ideal for designers looking to push the boundaries of hardware acceleration and complex, integrated circuit designs, encouraging innovation in both existing and emerging markets.

XC6SLX9-N3FT256I Features

This FPGA model comes equipped with a comprehensive set of features that enhance its efficiency and utility in complex electronics projects. Key features include:

  • High I/O count with 186 user I/O pins, providing ample flexibility for interfacing with other hardware components.
  • Compact 256-pin fine-pitch ball grid array (FTBGA) packaging, which enables a dense and efficient layout in space-constrained applications.
  • Integrated DSP slices for high-performance digital signal processing.
  • Low-power operation with options for advanced power management to ensure energy-efficient designs.
  • Robust support for multiple logic configurations, allowing for a highly adaptable and programmable logic environment.

XC6SLX9-N3FT256I Applications

  • Industrial Automation: Use in control systems and automation equipment to enhance operational efficiency and processing power.
  • Telecommunications: Applies to communication infrastructure for processing high-speed data transfers and signal conditioning.
  • Consumer Electronics: Integration into devices such as high-definition televisions and gaming consoles for advanced video processing capabilities.
  • Automotive Applications: Useful in driver assistance systems and in-vehicle infotainment to handle complex graphical and sensor data.
  • Medical Devices: Employed in medical imaging systems to support complex image processing and real-time diagnostic requirements.
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