XC6SLX100-2FGG676C

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Mfr.Part #
XC6SLX100-2FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 480 I/O 676FBGA
Stock
4,160
In Stock :
4,160

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Max Operating Temperature :
85°C
Number of Logic Elements/Cells :
101261
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
1.14V~1.26V
Base Part Number :
XC6SLX100
Operating Temperature :
0°C~85°C TJ
Number of I/O :
480
Speed Grade :
2
Series :
Spartan®-6 LX
Mounting Type :
Surface Mount
Mount :
Surface Mount
Factory Lead Time :
10 Weeks
Package / Case :
676-BGA
Total RAM Bits :
4939776
Number of Registers :
126576
Min Operating Temperature :
0°C
Number of Logic Blocks (LABs) :
7911
Published :
2008
Number of Pins :
676
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Supply Voltage :
1.2V
RAM Size :
603kB
Number of LABs/CLBs :
7911
Supplier Device Package :
676-FBGA (27x27)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX100-2FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC6SLX100, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:676-BGA, Number of Pins:676, XC6SLX100-2FGG676C pinout, XC6SLX100-2FGG676C datasheet PDF, XC6SLX100-2FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX100-2FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX100-2FGG676C


array of features suited for complex digital processing tasks. With 480 I/O options, this device provides ample connectivity for multiple peripherals, supporting versatile system designs. The FPGA architecture ensures that it can handle multiple functionalities simultaneously, ranging from simple logic control to complex algorithmic processing. Additionally, its 676FBGA packaging allows for a compact footprint while still offering the robust performance needed for high-density integrations, making it an essential component for both space-constrained and feature-rich applications.

XC6SLX100-2FGG676C Applications

  • Communications Infrastructure: In telecommunications equipment, the XC6SLX100-2FGG676C can be used to manage signal processing tasks, improving data throughput and reliability in systems such as routers and switches.
  • Consumer Electronics: This FPGA is ideal for high-performance consumer electronics, such as gaming consoles and high-definition video devices, where rapid data processing and enhanced graphical output are required.
  • Industrial Automation: Applied in automation systems, the XC6SLX100-2FGG676C enhances control and operational efficiencies, enabling smarter, faster decision-making processes and improved machine-to-machine communications.
  • Automotive Applications: Suitable for use in automotive safety and control systems, this FPGA helps in the rapid processing of real-time data critical for driver assistance technologies and in-vehicle infotainment systems.
  • Medical Devices: In medical imaging systems, such as MRI and ultrasound, the XC6SLX100-2FGG676C processes complex algorithms rapidly, ensuring high-resolution images that are crucial for accurate diagnostics.
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