XC6SLX75T-3FGG676C
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- Mfr.Part #
- XC6SLX75T-3FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 348 I/O 676FBGA
- Stock
- 742
- In Stock ：
- 742
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.2V
- Series :
- Spartan®-6 LXT
- Number of Terminations :
- 676
- RAM Size :
- 387kB
- Package / Case :
- 676-BGA
- Base Part Number :
- XC6SLX75
- Packaging :
- Tray
- Number of Registers :
- 93296
- Mount :
- Surface Mount
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Combinatorial Delay of a CLB-Max :
- 0.21 ns
- Number of LABs/CLBs :
- 5831
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 3170304
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 10 Weeks
- RoHS Status :
- ROHS3 Compliant
- Width :
- 27mm
- Height Seated (Max) :
- 2.44mm
- Number of Pins :
- 676
- Pbfree Code :
- yes
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 1.14V~1.26V
- Operating Supply Voltage :
- 1.2V
- Pin Count :
- 676
- Peak Reflow Temperature (Cel) :
- 250
- Speed Grade :
- 3
- Number of I/O :
- 348
- Number of Logic Elements/Cells :
- 74637
- Clock Frequency :
- 862MHz
- Length :
- 27mm
- Number of Outputs :
- 320
- Published :
- 2008
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC6SLX75T-3FGG676C
FPGAs AMD Xilinx XC6SLX75T-3FGG676C Overview
The FPGAs AMD Xilinx XC6SLX75T-3FGG676C is a highly capable integrated circuit designed for robust digital applications. Engineered by AMD Xilinx, a leader in programmable logic solutions, this FPGA model combines versatility with performance to meet the demanding needs of modern technology systems. Its compact 676-ball fine-pitch BGA package enables substantial I/O capabilities and efficient space utilization, making it ideal for applications that require high-density integration and advanced functionality. The XC6SLX75T-3FGG676C stands out for its ability to support complex digital computations while maintaining low power consumption and high reliability, crucial for scalable systems and innovations.
XC6SLX75T-3FGG676C Features
This specific FPGA offers a range of features tailored for advanced electronics applications. It provides 348 I/O pins, allowing extensive connectivity options for multiple peripherals and interfaces. The device operates efficiently under a speed grade of -3, ensuring rapid data processing and responsiveness. Additionally, the FPGA architecture of the XC6SLX75T-3FGG676C supports reconfigurable logic blocks, facilitating updates and modifications without the need for complete redesign, thus offering adaptability in dynamic technological environments.
XC6SLX75T-3FGG676C Applications
- Telecommunications: Utilized in routing and signal processing equipment, the XC6SLX75T-3FGG676C facilitates high-speed data transmission and enhanced signal integrity critical in modern communication infrastructures.
- Automotive: This FPGA is ideal for automotive applications, such as advanced driver-assistance systems (ADAS), where reliability and real-time processing are paramount.
- Consumer Electronics: In consumer electronics, such as smart home devices and high-performance gaming systems, the XC6SLX75T-3FGG676C enhances functionality and user experience by supporting complex user interfaces and connectivity solutions.
- Industrial: For industrial applications, this device is used in automation systems and robotics, providing the processing power needed for precise control and operational efficiency.
- Medical Devices: In the medical field, the FPGA is applied in imaging systems and diagnostic equipment, where high data throughput and processing capabilities are crucial for accurate results and real-time analytics.
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