XC6SLX75T-2FGG676C
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- Mfr.Part #
- XC6SLX75T-2FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 348 I/O 676FBGA
- Stock
- 328
- In Stock ：
- 328
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Number of I/O :
- 348
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Speed Grade :
- 2
- Number of Outputs :
- 320
- Base Part Number :
- XC6SLX75
- Number of Terminations :
- 676
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 250
- Clock Frequency :
- 667MHz
- RAM Size :
- 387kB
- Package / Case :
- 676-BGA
- Number of LABs/CLBs :
- 5831
- Mounting Type :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Number of Registers :
- 93296
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mount :
- Surface Mount
- Total RAM Bits :
- 3170304
- Operating Supply Voltage :
- 1.2V
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 74637
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Published :
- 2008
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- RoHS Status :
- ROHS3 Compliant
- Series :
- Spartan®-6 LXT
- Supply Voltage :
- 1.2V
- Number of Pins :
- 676
- Pbfree Code :
- yes
- ECCN Code :
- 3A991.D
- Voltage - Supply :
- 1.14V~1.26V
- Pin Count :
- 676
- Datasheets
- XC6SLX75T-2FGG676C
FPGAs AMD Xilinx XC6SLX75T-2FGG676C Overview
Introducing the AMD Xilinx XC6SLX75T-2FGG676C, a high-performance Field Programmable Gate Array (FPGA) that embodies cutting-edge technology suitable for a vast range of industrial applications. This FPGA is designed to offer exceptional versatility and adaptability, fulfilling the demanding requirements of modern digital systems. Its substantial logic density and rich feature set enable engineers and developers to target complex and computation-intensive tasks more effectively than ever before.
XC6SLX75T-2FGG676C Features
The XC6SLX75T-2FGG676C by AMD Xilinx boasts a robust array of features that make it a prime choice for high-demand applications. It includes 348 I/O pins, providing expansive connectivity options and flexibility in system design. Housed in a 676-pin FBGA package, it supports a dual QSPI interface which allows for high-speed data transmission and streamlined communication with peripheral devices. Its efficient power management and heat dissipation characteristics ensure optimal performance even under stringent operational conditions.
XC6SLX75T-2FGG676C Applications
- Telecommunications: In the realm of high-speed telecom infrastructure, this FPGA can manage multiple data streams and support complex signal processing algorithms, enhancing the efficiency and reliability of network systems.
- Automotive: Ideal for use in automotive safety and control systems, the XC6SLX75T-2FGG676C can process and relay critical data in real-time, improving vehicle response times and decision-making capabilities under varying conditions.
- Consumer Electronics: This FPGA can be utilized in smart home devices and advanced consumer electronics, offering the necessary computational power to drive innovative features and user interfaces.
- Industrial Automation: Its robust I/O capabilities make it suitable for complex industrial automation tasks, facilitating more efficient processing and control of machinery in manufacturing processes.
- Aerospace and Defense: The reliability and adaptability of the XC6SLX75T-2FGG676C make it a perfect choice for aerospace applications, where it can contribute to navigation systems, monitoring equipment, and overall mission-critical operations.
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