XC6SLX75-N3FGG484I

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Mfr.Part #
XC6SLX75-N3FGG484I
Manufacturer
AMD Xilinx
Package / Case
FBGA
Datasheet
Download
Description
IC FPGA 280 I/O 484FBGA
Stock
22,925
In Stock :
22,925

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Temperature Grade :
Industrial
Mount :
Surface Mount
Number of Terminations :
484
Number of Registers :
93296
Clock Frequency :
806MHz
Number of Pins :
484
Length :
23mm
Min Operating Temperature :
-40°C
Number of Outputs :
280
ECCN Code :
3A991.D
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Power Supplies :
1.21.2/3.32.5/3.3V
Number of I/O :
280
Supply Voltage-Max (Vsup) :
1.26V
RAM Size :
387kB
Supply Voltage :
1.2V
Combinatorial Delay of a CLB-Max :
0.26 ns
HTS Code :
8542.39.00.01
Number of Logic Blocks (LABs) :
5831
Package / Case :
FBGA
Terminal Form :
Ball
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
30
Width :
23mm
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
2.6mm
Max Operating Temperature :
100°C
Terminal Position :
BOTTOM
Operating Supply Voltage :
1.2V
Number of Logic Elements/Cells :
74637
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
RoHS Status :
RoHS Compliant
Peak Reflow Temperature (Cel) :
250
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX75-N3FGG484I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:484, Number of Pins:484, Package / Case:FBGA, XC6SLX75-N3FGG484I pinout, XC6SLX75-N3FGG484I datasheet PDF, XC6SLX75-N3FGG484I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX75-N3FGG484I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX75-N3FGG484I


FPGAs AMD Xilinx XC6SLX75-N3FGG484I Overview

Introducing the FPGAs AMD Xilinx XC6SLX75-N3FGG484I, a highly capable field-programmable gate array designed for robust multi-application support. This IC FPGA from AMD Xilinx features a dense 484-ball fine-pitch BGA package and supports up to 280 I/O options, making it exceptionally versatile for various complex digital circuits. Engineered for high performance and reliability, the XC6SLX75-N3FGG484I caters to developers looking for scalable solutions in high-demand environments. With advanced features tailored to facilitate design productivity and reduce development time, this FPGA is ideal for applications requiring high-speed data processing and extensive I/O interfacing.

XC6SLX75-N3FGG484I Features

This FPGA stands out with its integration of leading-edge technologies and user-centric functionalities. It features a robust logic cell architecture that can efficiently handle multiple signal processing tasks simultaneously. The XC6SLX75-N3FGG484I also offers a substantial amount of logic resources, which are crucial for implementing complex algorithms and designs. Additionally, its high thermal tolerance and low power consumption make it suitable for extended operational periods, thus ensuring sustainability and reduced operational costs.

XC6SLX75-N3FGG484I Applications

  • Telecommunications Equipment: Utilizes its high I/O count and processing capability to manage complex signal processing tasks required in modern telecom infrastructures.
  • Automotive Driver Assistance Systems: Employs advanced processing power to interpret sensor data rapidly, enhancing real-time decision-making in safety-critical systems.
  • Industrial Automation: Drives the backbone of automated systems with its ability to coordinate multiple inputs and outputs efficiently, ensuring seamless manufacturing processes.
  • Consumer Electronics: Supports high-performance requirements for video processing and gaming consoles, providing exceptional user experiences with reduced latency and increased responsiveness.
  • Medical Devices: Facilitates the handling and analysis of extensive data from medical imaging devices, improving diagnostic accuracy and patient outcomes.
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