XC6SLX75-N3CSG484C
- Mfr.Part #
- XC6SLX75-N3CSG484C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-FBGA, CSPBGA
- Datasheet
- Download
- Description
- IC FPGA 328 I/O 484CSBGA
- Stock
- 43,171
- In Stock :
- 43,171
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e1
- Operating Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Package / Case :
- 484-FBGA, CSPBGA
- Base Part Number :
- XC6SLX75
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Power Supplies :
- 1.21.2/3.32.5/3.3V
- Series :
- Spartan®-6 LX
- Mount :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 260
- ECCN Code :
- 3A991.D
- Voltage - Supply :
- 1.14V~1.26V
- Total RAM Bits :
- 3170304
- Number of Terminations :
- 484
- Clock Frequency :
- 806MHz
- Number of LABs/CLBs :
- 5831
- Number of Registers :
- 93296
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.26 ns
- Number of Logic Elements/Cells :
- 74637
- Supply Voltage :
- 1.2V
- Number of Outputs :
- 328
- Terminal Form :
- Ball
- Packaging :
- Tray
- HTS Code :
- 8542.39.00.01
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 10 Weeks
- Number of Pins :
- 484
- Width :
- 19mm
- Number of I/O :
- 328
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 1.8mm
- Length :
- 19mm
- Terminal Pitch :
- 0.8mm
- RAM Size :
- 387kB
- Published :
- 2008
- Terminal Finish :
- TIN SILVER COPPER
- Datasheets
- XC6SLX75-N3CSG484C

FPGAs AMD Xilinx XC6SLX75-N3CSG484C Overview
The AMD Xilinx XC6SLX75-N3CSG484C represents a state-of-the-art Field Programmable Gate Array solution, designed for high-performance in a multitude of electronic applications. Manifesting a balanced combination of versatility and efficiency, this FPGA caters to designers and engineers looking to integrate a reliable, configurable logic block into their systems. Its 484-pin Chip-Size BGA packaging ensures a compact footprint, while enabling extensive interfacing capabilities. This sophistication positions the XC6SLX75-N3CSG484C as a prime choice for B2B customers desiring bulk purchases for scalable projects or products.
XC6SLX75-N3CSG484C Features
The XC6SLX75-N3CSG484C features include:
- 328 Input/Output pins for flexible, multi-faceted interfacing
- High-density, low-power 45nm process technology
- Advanced FPGA architecture for enhanced processing and rapid data handling
- Efficient logic and memory integration to accommodate complex designs
- User-friendly programming environment for ease of design and implementation
XC6SLX75-N3CSG484C Applications
- Consumer Electronics: Utilized in smart home devices to facilitate communication between various sensors and actuators.
- Industrial Automation: Acts as a control unit in automated assembly lines, streamlining processes and improving efficiency.
- Telecommunications: Serves as a key component in communication infrastructure, enhancing signal processing capabilities.
- Automotive: Integrated into vehicle systems to support advanced driver- assistance systems (ADAS) for safer driving experiences.
- Medical Devices: Ensures reliable operation of diagnostic equipment, vital for processing complex computations and real-time data analysis.
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