XC6SLX75-L1FGG484C
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- Mfr.Part #
- XC6SLX75-L1FGG484C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA
- Datasheet
- Download
- Description
- IC FPGA 280 I/O 484FBGA
- Stock
- 48,663
- In Stock ：
- 48,663
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 1.14V~1.26V
- Number of Pins :
- 484
- Base Part Number :
- XC6SLX75
- Number of Logic Elements/Cells :
- 74637
- Pin Count :
- 484
- Peak Reflow Temperature (Cel) :
- 250
- JESD-609 Code :
- e1
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 5831
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 23mm
- Mounting Type :
- Surface Mount
- Number of I/O :
- 280
- Published :
- 2008
- Total RAM Bits :
- 3170304
- Combinatorial Delay of a CLB-Max :
- 0.46 ns
- Package / Case :
- 484-BBGA
- Supply Voltage :
- 1V
- Number of Outputs :
- 280
- Height Seated (Max) :
- 2.6mm
- HTS Code :
- 8542.39.00.01
- Mount :
- Surface Mount
- Number of Registers :
- 93296
- Operating Supply Voltage :
- 1V
- Number of Terminations :
- 484
- ECCN Code :
- 3A991.D
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 387kB
- RoHS Status :
- ROHS3 Compliant
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Series :
- Spartan®-6 LX
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Power Supplies :
- 12.5/3.3V
- Width :
- 23mm
- Pbfree Code :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC6SLX75-L1FGG484C
FPGAs AMD Xilinx XC6SLX75-L1FGG484C Overview
The AMD Xilinx XC6SLX75-L1FGG484C FPGA stands as a high-performance, adaptable solution engineered to meet the demanding requirements of modern digital applications. As a member of Xilinx's Spartan-6 family, this FPGA integrates advanced features into a single chip, offering a robust platform for developers looking to deploy fast and efficient designs. With its 484-pin ball grid array (FBGA) packaging and 280 I/O options, it provides ample flexibility for a wide range of applications, making it an ideal choice for designers aiming to optimize their systems for performance and cost.
XC6SLX75-L1FGG484C Features
- 280 I/O pins for versatile connectivity and integration options.
- 484FBGA packaging ensures compact and efficient layout designs.
- High-performance logic operations due to advanced FPGA architecture.
- Compatible with multiple design platforms provided by AMD Xilinx, ensuring seamless integration and development support.
XC6SLX75-L1FGG484C Applications
- Telecommunications: Used in the infrastructure of telecom networks to manage signal processing and data flow efficiently.
- Automotive Systems: Integrates into driver assistance systems to process real-time data from sensors and cameras.
- Consumer Electronics: Forms the core processing unit in high-definition multimedia interfaces and portable devices.
- Industrial Automation: Employs in control systems to handle complex operational algorithms in manufacturing processes.
- Medical Equipment: Enhances diagnostic and imaging systems through superior data processing capabilities.
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