XC6SLX75-3FGG676C

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Mfr.Part #
XC6SLX75-3FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 408 I/O 676FBGA
Stock
44,629
In Stock :
44,629

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Number of Terminations :
676
Terminal Position :
BOTTOM
Operating Supply Voltage :
1.2V
Series :
Spartan®-6 LX
Speed Grade :
3
Number of I/O :
408
Total RAM Bits :
3170304
Time@Peak Reflow Temperature-Max (s) :
30
Factory Lead Time :
10 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
1mm
Number of Pins :
676
Mount :
Surface Mount
Clock Frequency :
862MHz
RAM Size :
387kB
Packaging :
Tray
Voltage - Supply :
1.14V~1.26V
Peak Reflow Temperature (Cel) :
250
Published :
2008
Operating Temperature :
0°C~85°C TJ
Number of Registers :
93296
Length :
27mm
Package / Case :
676-BGA
Number of Logic Elements/Cells :
74637
Number of LABs/CLBs :
5831
Width :
27mm
Qualification Status :
Not Qualified
Pin Count :
676
JESD-609 Code :
e1
Height Seated (Max) :
2.44mm
Supply Voltage :
1.2V
Pbfree Code :
yes
Number of Outputs :
400
Terminal Form :
Ball
Base Part Number :
XC6SLX75
Combinatorial Delay of a CLB-Max :
0.21 ns
Datasheets
XC6SLX75-3FGG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX75-3FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:676, Number of Pins:676, Operating Temperature:0°C~85°C TJ, Package / Case:676-BGA, Base Part Number:XC6SLX75, XC6SLX75-3FGG676C pinout, XC6SLX75-3FGG676C datasheet PDF, XC6SLX75-3FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX75-3FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX75-3FGG676C


FPGAs AMD Xilinx XC6SLX75-3FGG676C Overview

The FPGAs AMD Xilinx XC6SLX75-3FGG676C represents a state-of-the-art FPGA from AMD Xilinx, tailored for advanced digital processing and high-volume applications. This integrated circuit is housed in a 676FBGA package, supporting a robust 408 I/O interface that enables versatile connectivity and integration into multiple systems. Its design is focused on delivering high performance, reliability, and scalability, making it an ideal solution for designers looking to push the boundaries of technology in their respective fields.

XC6SLX75-3FGG676C Features

This FPGA is engineered for efficiency and high-speed performance. It includes features such as advanced logic cells, a high I/O count in a compact form factor, and a high-speed transceiver block. These features make it particularly suited for complex digital computations and signal processing tasks that require agility and precision.

XC6SLX75-3FGG676C Applications

  • Telecommunications: Utilized in communication infrastructure, the XC6SLX75-3FGG676C helps manage and route data efficiently across multiple network layers.
  • Automotive Systems: Critical in driver assistance systems, this FPGA can process multiple sensor inputs simultaneously, enhancing vehicle safety and performance.
  • Consumer Electronics: Integral in smart home devices, where it manages inputs from various sensors and outputs to control systems, improving user interaction and functionality.
  • Industrial Automation: In automation systems, it controls machinery and processes data from various sensors to optimize and streamline operations.
  • Medical Devices: Used in medical imaging systems, the XC6SLX75-3FGG676C processes complex algorithms quickly to provide real-time imaging results.
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