XC6SLX25T-N3CSG324C
- Mfr.Part #
- XC6SLX25T-N3CSG324C
- Manufacturer
- AMD Xilinx
- Package / Case
- 324-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 324CSBGA
- Stock
- 35,246
- In Stock :
- 35,246
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Form :
- Ball
- Supply Voltage :
- 1.2V
- Number of Terminations :
- 324
- Number of Outputs :
- 190
- RoHS Status :
- ROHS3 Compliant
- Width :
- 15mm
- Clock Frequency :
- 806MHz
- Packaging :
- Tray
- Height Seated (Max) :
- 1.5mm
- Number of Registers :
- 30064
- Total RAM Bits :
- 958464
- Operating Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 24051
- ECCN Code :
- EAR99
- Published :
- 2008
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 1879
- Power Supplies :
- 1.21.2/3.32.5/3.3V
- HTS Code :
- 8542.39.00.01
- RAM Size :
- 117kB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- yes
- Package / Case :
- 324-LFBGA, CSPBGA
- Series :
- Spartan®-6 LXT
- Qualification Status :
- Not Qualified
- Mount :
- Surface Mount
- Voltage - Supply :
- 1.14V~1.26V
- Number of Pins :
- 324
- Terminal Pitch :
- 0.8mm
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Number of I/O :
- 190
- Combinatorial Delay of a CLB-Max :
- 0.26 ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 15mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Base Part Number :
- XC6SLX25
- Terminal Finish :
- TIN SILVER COPPER
- JESD-609 Code :
- e1
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC6SLX25T-N3CSG324C
FPGAs AMD Xilinx XC6SLX25T-N3CSG324C Overview
The FPGAs AMD Xilinx XC6SLX25T-N3CSG324C is a cutting-edge field-programmable gate array (FPGA) designed for high-performance applications requiring substantial logic and I/O resources. This device integrates 190 I/O pins and is housed in a 324-pin CSBGA package, making it highly versatile for a wide range of industrial and commercial applications. With its robust feature set and flexibility, the XC6SLX25T-N3CSG324C is ideal for developers looking to push the boundaries of hardware acceleration and complex digital processing tasks.
XC6SLX25T-N3CSG324C Features
This FPGA model from AMD Xilinx features a high-density layout that supports a vast array of logic operations and interconnectivity options. It's built to handle complex algorithms and multi-threaded processes efficiently, making it suitable for both prototyping and production scales. The device's 324-pin CSBGA package ensures a compact footprint while providing ample room for all necessary connections and functionalities.
XC6SLX25T-N3CSG324C Applications
- Consumer Electronics: Used in devices such as smartphones and tablets, the XC6SLX25T-N3CSG324C can manage multiple functionalities like image processing and user interface enhancements simultaneously.
- Automotive Systems: Implements advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors to provide real-time responses and alerts.
- Industrial Automation: Enhances control systems in manufacturing lines by allowing for programmable logic controllers (PLCs) to adapt to new processes quickly and efficiently.
- Data Centers: Supports high-speed data processing tasks, ensuring efficient management of large data flows and storage solutions.
- Telecommunications: Ideal for base station development and management, facilitating improved data throughput and network reliability in communication infrastructures.
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