XC6SLX25T-4FGG484C

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Mfr.Part #
XC6SLX25T-4FGG484C
Manufacturer
AMD Xilinx
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 250 I/O 484FBGA
Stock
26,372
In Stock :
26,372

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Spartan®-6 LXT
Length :
23mm
RAM Size :
117kB
Number of Pins :
484
Terminal Pitch :
1mm
Terminal Form :
Ball
Width :
23mm
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Operating Temperature :
0°C~85°C TJ
Package / Case :
484-BBGA
Base Part Number :
XC6SLX25
Qualification Status :
Not Qualified
Published :
2008
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
250
Mount :
Surface Mount
Height Seated (Max) :
2.6mm
Number of Logic Elements/Cells :
24051
Number of Outputs :
250
JESD-609 Code :
e1
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
RoHS Compliant
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
Voltage - Supply :
1.14V~1.26V
Reach Compliance Code :
Unknown
Number of LABs/CLBs :
1879
Total RAM Bits :
958464
Number of Terminations :
484
Pin Count :
484
Packaging :
Tray
Power Supplies :
1.22.5/3.3V
Peak Reflow Temperature (Cel) :
250
Time@Peak Reflow Temperature-Max (s) :
30
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX25T-4FGG484C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:484, Operating Temperature:0°C~85°C TJ, Package / Case:484-BBGA, Base Part Number:XC6SLX25, Mounting Type:Surface Mount, Number of Terminations:484, XC6SLX25T-4FGG484C pinout, XC6SLX25T-4FGG484C datasheet PDF, XC6SLX25T-4FGG484C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX25T-4FGG484C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX25T-4FGG484C


FPGAs AMD Xilinx XC6SLX25T-4FGG484C Overview

The FPGAs AMD Xilinx XC6SLX25T-4FGG484C represents a cutting-edge solution in the realm of programmable logic devices, engineered by AMD Xilinx, a leader in this innovative technology. Designed to meet the rigorous demands of high-speed digital processing, this FPGA (Field Programmable Gate Array) integrates a powerful combination of performance, flexibility, and high-density I/O, making it ideal for a diverse range of applications. Its 484-pin FBGA (Fine-Pitch Ball Grid Array) package ensures compact integration and superior performance in space-constrained applications. This overview will delve into the key features and potential applications of this versatile component, emphasizing its suitability for businesses seeking robust and adaptable solutions.

XC6SLX25T-4FGG484C Features

This FPGA model boasts a robust array of features designed to support complex digital systems. Key features include:

  • 250 I/O pins enabling extensive connectivity and interface options.
  • A high-capacity logic matrix that allows for the efficient handling of multiple and complex logic operations simultaneously.
  • Advanced configuration memory, enhancing the device's flexibility and ease of integration into custom solutions.
  • High-speed DSP slices that are optimal for signal processing tasks.
  • Low power consumption combined with high performance, aligning with the needs of energy-efficient, high-speed computing.

XC6SLX25T-4FGG484C Applications

  • Telecommunications: Used in routers and switches for processing and managing large volumes of data.
  • Automotive: Integral in advanced driver-assistance systems (ADAS) to process real-time sensor data.
  • Consumer Electronics: Deployed in high-definition multimedia interfaces (HDMI) and portable electronics for enhanced video and audio processing capabilities.
  • Industrial: Utilized in machine vision systems for real-time analysis and quality control.
  • Medical Devices: Applied in medical imaging equipment, helping in the processing and analysis of complex imaging data.
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