XC6SLX25-3FTG256I

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Mfr.Part #
XC6SLX25-3FTG256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 186 I/O 256FTBGA
Stock
12,357
In Stock :
12,357

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
10 Weeks
Operating Temperature :
-40°C~100°C TJ
Package / Case :
256-LBGA
Number of Pins :
256
Mount :
Surface Mount
RoHS Status :
ROHS3 Compliant
RAM Size :
117kB
Published :
2008
Series :
Spartan®-6 LX
Base Part Number :
XC6SLX25
Operating Supply Voltage :
1.2V
Number of Registers :
30064
Mounting Type :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Number of I/O :
186
Total RAM Bits :
958464
Number of LABs/CLBs :
1879
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supplier Device Package :
256-FTBGA (17x17)
Min Operating Temperature :
-40°C
Speed Grade :
3
Max Operating Temperature :
100°C
Number of Logic Elements/Cells :
24051
Packaging :
Tray
Number of Logic Blocks (LABs) :
1879
Datasheets
XC6SLX25-3FTG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX25-3FTG256I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:256-LBGA, Number of Pins:256, Base Part Number:XC6SLX25, Mounting Type:Surface Mount, XC6SLX25-3FTG256I pinout, XC6SLX25-3FTG256I datasheet PDF, XC6SLX25-3FTG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX25-3FTG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX25-3FTG256I


FPGAs AMD Xilinx XC6SLX25-3FTG256I Overview

The AMD Xilinx XC6SLX25-3FTG256I is a highly capable FPGA (Field Programmable Gate Array) that delivers exceptional performance and flexibility for a broad range of applications. Designed to meet the demanding requirements of modern technology systems, this integrated circuit features a robust 256FTBGA package that provides 186 I/O options for versatile connectivity and integration. Ideal for developers looking to push the boundaries of innovation, the XC6SLX25-3FTG256I is engineered to support complex digital computations while optimizing power efficiency and reducing overall system costs.

XC6SLX25-3FTG256I Features

This FPGA model is equipped with a dynamic architecture that allows for rapid prototyping and customization, making it suitable for both high-volume production and sophisticated experimental setups. Key features include advanced logic utilization, integrated DSP slices for high-performance processing, and ample memory resources. Additionally, its support for high-speed serial connectivity ensures that it can handle intensive data flows and interface seamlessly with other components in a system.

XC6SLX25-3FTG256I Applications

  • Telecommunications: Utilized in routers and switches, the XC6SLX25-3FTG256I manages data packet routing and signal processing, enhancing network efficiency and bandwidth management.
  • Automotive Systems: Key in the development of automotive safety features, such as collision detection systems, where its processing capabilities allow for real-time decision making and system responsiveness.
  • Consumer Electronics: Integral to the design of multimedia devices like high-definition televisions and gaming consoles, offering support for complex graphics processing and multi-functionality in user interfaces.
  • Industrial Automation: Helps in the automation of machinery and processes, improving operational efficiency and reliability in environments like manufacturing plants.
  • Medical Devices: Applied in medical imaging systems, enabling quick data processing and detailed image reconstruction, crucial for accurate diagnosis and treatment planning.
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