XC6SLX16-3FTG256C
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- Mfr.Part #
- XC6SLX16-3FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 186 I/O 256FTBGA
- Stock
- 768
- In Stock ：
- 768
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 1.55mm
- Number of Terminations :
- 256
- Number of Pins :
- 256
- ECCN Code :
- EAR99
- Base Part Number :
- XC6SLX16
- Operating Supply Voltage :
- 1.2V
- JESD-609 Code :
- e1
- Pin Count :
- 256
- Operating Temperature :
- 0°C~85°C TJ
- Package / Case :
- 256-LBGA
- Factory Lead Time :
- 10 Weeks
- Voltage - Supply :
- 1.14V~1.26V
- Number of Logic Elements/Cells :
- 14579
- Pbfree Code :
- yes
- Peak Reflow Temperature (Cel) :
- 260
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- RAM Size :
- 72kB
- Number of LABs/CLBs :
- 1139
- Number of Registers :
- 18224
- Clock Frequency :
- 862MHz
- Number of Outputs :
- 186
- Length :
- 17mm
- Width :
- 17mm
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Total RAM Bits :
- 589824
- Number of I/O :
- 186
- Terminal Form :
- Ball
- Combinatorial Delay of a CLB-Max :
- 0.21 ns
- Published :
- 2008
- Speed Grade :
- 3
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Series :
- Spartan®-6 LX
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XC6SLX16-3FTG256C
FPGAs AMD Xilinx XC6SLX16-3FTG256C Overview
The FPGAs AMD Xilinx XC6SLX16-3FTG256C is a state-of-the-art field-programmable gate array designed to meet the rigorous demands of modern digital circuits. This versatile component is built on AMD Xilinx's advanced technology, enabling significant customization post-manufacturing to suit a broad range of applications. Featuring a compact 256FTBGA package, it offers a perfect balance of power, flexibility, and space efficiency, making it an ideal choice for developers looking to push the boundaries of hardware performance and design innovation. The incorporation of 186 I/O points provides ample connectivity for complex digital environments, ensuring a seamless integration into diverse hardware setups.
XC6SLX16-3FTG256C Features
This FPGA device integrates multiple key features including high-density logic gates, an abundant set of I/O pins, and support for various logic configurations, all packed within a 256-pin fine-pitch ball grid array (FBGA). This configuration not only facilitates robust performance in high-speed signal processing and real-time data management but also enhances the reliability and scalability of integrated systems. Additional attributes such as low power consumption and advanced heat dissipation techniques underscore its suitability for extended operational life in demanding scenarios.
XC6SLX16-3FTG256C Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and gaming consoles, the XC6SLX16-3FTG256C improves processing power and energy efficiency, enhancing user experience and device functionality.
- Automotive Systems: Key to advanced driver-assistance systems (ADAS), this FPGA provides the necessary computational power and connectivity to handle sensors and actuators, improving vehicle safety and performance.
- Industrial Automation: In factory settings, this FPGA enables the automation of complex tasks such as robotic control and machine vision, increasing precision and productivity while reducing operational costs.
- Communication Infrastructure: Critical in the development of telecommunications equipment, the XC6SLX16-3FTG256C helps manage data flows in network hardware, supporting enhanced data processing capabilities and connectivity.
- Medical Devices: Applied in medical imaging systems, such as X-ray and MRI machines, it supports high-resolution image processing and real-time diagnostics, critical for improving patient outcomes.
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