XC6SLX150T-3FGG676C
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- Mfr.Part #
- XC6SLX150T-3FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 396 I/O 676FBGA
- Stock
- 303
- In Stock ：
- 303
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Clock Frequency :
- 862MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Outputs :
- 396
- RAM Size :
- 603kB
- Height Seated (Max) :
- 2.44mm
- Number of Registers :
- 184304
- JESD-609 Code :
- e1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- ROHS3 Compliant
- Combinatorial Delay of a CLB-Max :
- 0.21 ns
- Number of I/O :
- 396
- Length :
- 27mm
- Operating Supply Voltage :
- 1.2V
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 250
- Number of Logic Elements/Cells :
- 147443
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Pitch :
- 1mm
- Package / Case :
- 676-BGA
- Speed Grade :
- 3
- Qualification Status :
- Not Qualified
- Pbfree Code :
- yes
- Mount :
- Surface Mount
- Number of Terminations :
- 676
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 11519
- Packaging :
- Tray
- Number of Pins :
- 676
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 27mm
- Supply Voltage :
- 1.2V
- Pin Count :
- 676
- Factory Lead Time :
- 10 Weeks
- Series :
- Spartan®-6 LXT
- Terminal Form :
- Ball
- Base Part Number :
- XC6SLX150
- Published :
- 2008
- Operating Temperature :
- 0°C~85°C TJ
- Total RAM Bits :
- 4939776
- Datasheets
- XC6SLX150T-3FGG676C
FPGAs AMD Xilinx XC6SLX150T-3FGG676C Overview
The FPGAs AMD Xilinx XC6SLX150T-3FGG676C is a high-performance Field Programmable Gate Array (FPGA) that embodies cutting-edge technology from AMD Xilinx, a leader in programmable logic solutions. Designed to deliver superior processing power and flexibility, this FPGA features a robust 676-pin ball grid array (FBGA) packaging, making it ideal for advanced digital processing tasks. This product is specifically engineered to cater to the demands of high-speed and high-density applications where design customization and scalability are crucial. The XC6SLX150T-3FGG676C enables designers to create highly differentiated applications without the high cost and lengthy development times associated with traditional ASIC product development.
XC6SLX150T-3FGG676C Features
The XC6SLX150T-3FGG676C FPGA from AMD Xilinx boasts an array of features that make it a go-to choice for engineers and designers. Key features include 396 programmable input/output ports which provide extensive interface options, and advanced digital signal processing capabilities. This FPGA supports a variety of logic optimization techniques, has integrated DSP slices for efficient data handling, and operates at a speed grade of -3, offering enhanced performance for time-critical applications. Its 676FBGA packaging is designed for optimal thermal management and reduced footprint on PCBs.
XC6SLX150T-3FGG676C Applications
- Telecommunications: Used in routing and switching solutions, the XC6SLX150T-3FGG676C manages data flow efficiently, ensuring high-speed communication and robust performance in complex telecom infrastructures.
- Automotive Technology: Integral in driver assistance systems, this FPGA processes multiple sensor inputs simultaneously, providing real-time responses critical in automotive safety applications.
- Medical Imaging: The high data processing capability of the XC6SLX150T-3FGG676C makes it perfect for medical imaging devices, such as MRI and ultrasound scanners, enhancing image clarity and processing speed.
- Consumer Electronics: In home entertainment systems and smart devices, this FPGA offers the necessary processing power to handle multiple user interfaces and complex user inputs seamlessly.
- Industrial Automation: By controlling machinery and processes, the XC6SLX150T-3FGG676C optimizes operational efficiencies and supports the advanced control systems used in modern industrial environments.
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