XC6SLX150-3FGG900C
- Mfr.Part #
- XC6SLX150-3FGG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 576 I/O 900FBGA
- Stock
- 357
- In Stock :
- 357
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RAM Size :
- 603kB
- Height Seated (Max) :
- 2.6mm
- Terminal Position :
- BOTTOM
- Published :
- 2008
- Mounting Type :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Supply Voltage :
- 1.2V
- Package / Case :
- 900-BBGA
- Peak Reflow Temperature (Cel) :
- 250
- Factory Lead Time :
- 10 Weeks
- Operating Supply Voltage :
- 1.2V
- Pbfree Code :
- yes
- Total RAM Bits :
- 4939776
- Number of Outputs :
- 570
- Terminal Pitch :
- 1mm
- Series :
- Spartan®-6 LX
- Combinatorial Delay of a CLB-Max :
- 0.21 ns
- RoHS Status :
- ROHS3 Compliant
- Mount :
- Surface Mount
- Speed Grade :
- 3
- JESD-609 Code :
- e1
- Clock Frequency :
- 862MHz
- Number of I/O :
- 576
- Number of Terminations :
- 900
- Number of LABs/CLBs :
- 11519
- Number of Registers :
- 184304
- Number of Logic Elements/Cells :
- 147443
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Base Part Number :
- XC6SLX150
- Packaging :
- Tray
- Voltage - Supply :
- 1.14V~1.26V
- Qualification Status :
- Not Qualified
- Number of Pins :
- 900
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Pin Count :
- 900
- Datasheets
- XC6SLX150-3FGG900C

FPGAs AMD Xilinx XC6SLX150-3FGG900C Overview
The FPGAs AMD Xilinx XC6SLX150-3FGG900C is a high-performance, field-programmable gate array designed by AMD Xilinx to meet the demanding needs of modern digital circuits. This FPGA is housed in a 900FBGA package, boasting a substantial array of 576 I/O pins, which allows for versatile and flexible interfacing options. With its advanced features and robust design, this FPGA is ideal for developers looking to push the boundaries of hardware acceleration, signal processing, and complex logic integration. The XC6SLX150-3FGG900C is particularly suitable for applications requiring high-speed data processing and substantial logic capacity, making it a cornerstone in the development of high-performance, scalable electronic systems.
XC6SLX150-3FGG900C Features
The XC6SLX150-3FGG900C FPGA from AMD Xilinx offers numerous features that make it a powerful choice for developers and engineers. Key features include a high density of logic cells, advanced DSP slices for efficient signal processing, and flexible I/O options to cater to a wide range of application needs. Additionally, its compatibility with high-speed serial communication protocols ensures that it can be integrated into complex digital systems with ease.
XC6SLX150-3FGG900C Applications
- Data Centers: Utilized in server farms for accelerating complex computations and data processing tasks, improving efficiency and performance.
- Telecommunications: Employs its high I/O count and processing power to handle signal processing tasks in telecommunications infrastructure, enhancing data throughput and reliability.
- Automotive: Applied in automotive systems for processing and managing in-vehicle communications and sensor data, crucial for advanced driver-assistance systems (ADAS).
- Industrial Automation: Used in control systems for real-time processing of input/output operations, ensuring high precision and reliability in automated tasks.
- Consumer Electronics: Integrates into consumer electronics to provide enhanced multimedia experiences and interactive functionality, boosting device capabilities and user engagement.
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