XC6SLX150-3FGG900C

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Mfr.Part #
XC6SLX150-3FGG900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 576 I/O 900FBGA
Stock
357
In Stock :
357

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RAM Size :
603kB
Height Seated (Max) :
2.6mm
Terminal Position :
BOTTOM
Published :
2008
Mounting Type :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Supply Voltage :
1.2V
Package / Case :
900-BBGA
Peak Reflow Temperature (Cel) :
250
Factory Lead Time :
10 Weeks
Operating Supply Voltage :
1.2V
Pbfree Code :
yes
Total RAM Bits :
4939776
Number of Outputs :
570
Terminal Pitch :
1mm
Series :
Spartan®-6 LX
Combinatorial Delay of a CLB-Max :
0.21 ns
RoHS Status :
ROHS3 Compliant
Mount :
Surface Mount
Speed Grade :
3
JESD-609 Code :
e1
Clock Frequency :
862MHz
Number of I/O :
576
Number of Terminations :
900
Number of LABs/CLBs :
11519
Number of Registers :
184304
Number of Logic Elements/Cells :
147443
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Base Part Number :
XC6SLX150
Packaging :
Tray
Voltage - Supply :
1.14V~1.26V
Qualification Status :
Not Qualified
Number of Pins :
900
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Pin Count :
900
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX150-3FGG900C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:900-BBGA, Number of Terminations:900, Base Part Number:XC6SLX150, Number of Pins:900, XC6SLX150-3FGG900C pinout, XC6SLX150-3FGG900C datasheet PDF, XC6SLX150-3FGG900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX150-3FGG900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX150-3FGG900C


FPGAs AMD Xilinx XC6SLX150-3FGG900C Overview

The FPGAs AMD Xilinx XC6SLX150-3FGG900C is a high-performance, field-programmable gate array designed by AMD Xilinx to meet the demanding needs of modern digital circuits. This FPGA is housed in a 900FBGA package, boasting a substantial array of 576 I/O pins, which allows for versatile and flexible interfacing options. With its advanced features and robust design, this FPGA is ideal for developers looking to push the boundaries of hardware acceleration, signal processing, and complex logic integration. The XC6SLX150-3FGG900C is particularly suitable for applications requiring high-speed data processing and substantial logic capacity, making it a cornerstone in the development of high-performance, scalable electronic systems.

XC6SLX150-3FGG900C Features

The XC6SLX150-3FGG900C FPGA from AMD Xilinx offers numerous features that make it a powerful choice for developers and engineers. Key features include a high density of logic cells, advanced DSP slices for efficient signal processing, and flexible I/O options to cater to a wide range of application needs. Additionally, its compatibility with high-speed serial communication protocols ensures that it can be integrated into complex digital systems with ease.

XC6SLX150-3FGG900C Applications

  • Data Centers: Utilized in server farms for accelerating complex computations and data processing tasks, improving efficiency and performance.
  • Telecommunications: Employs its high I/O count and processing power to handle signal processing tasks in telecommunications infrastructure, enhancing data throughput and reliability.
  • Automotive: Applied in automotive systems for processing and managing in-vehicle communications and sensor data, crucial for advanced driver-assistance systems (ADAS).
  • Industrial Automation: Used in control systems for real-time processing of input/output operations, ensuring high precision and reliability in automated tasks.
  • Consumer Electronics: Integrates into consumer electronics to provide enhanced multimedia experiences and interactive functionality, boosting device capabilities and user engagement.
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