XC6SLX150-3FG676C
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- Mfr.Part #
- XC6SLX150-3FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 498 I/O 676FCBGA
- Stock
- 12
- In Stock ：
- 12
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Number of Terminations :
- 676
- Supply Voltage :
- 1.2V
- Operating Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Registers :
- 184304
- Height Seated (Max) :
- 2.44mm
- Number of LABs/CLBs :
- 11519
- JESD-609 Code :
- e0
- Mounting Type :
- Surface Mount
- Base Part Number :
- XC6SLX150
- Pbfree Code :
- No
- Total RAM Bits :
- 4939776
- Width :
- 27mm
- Published :
- 2008
- Peak Reflow Temperature (Cel) :
- 225
- Combinatorial Delay of a CLB-Max :
- 0.21 ns
- Clock Frequency :
- 862MHz
- Voltage - Supply :
- 1.14V~1.26V
- Number of Logic Elements/Cells :
- 147443
- Length :
- 27mm
- Terminal Form :
- Ball
- Number of Pins :
- 676
- Number of I/O :
- 498
- Packaging :
- Tray
- Factory Lead Time :
- 10 Weeks
- RoHS Status :
- Non-RoHS Compliant
- Speed Grade :
- 3
- Series :
- Spartan®-6 LX
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Operating Temperature :
- 0°C~85°C TJ
- Number of Outputs :
- 498
- Package / Case :
- 676-BBGA, FCBGA
- RAM Size :
- 603kB
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Pin Count :
- 676
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC6SLX150-3FG676C
FPGAs AMD Xilinx XC6SLX150-3FG676C Overview
Introducing the FPGAs AMD Xilinx XC6SLX150-3FG676C, a high-performance field-programmable gate array designed for advanced applications that demand robust processing capabilities and versatile I/O options. This product from AMD Xilinx offers a strategic blend of speed, density, and power efficiency, making it an ideal choice for developers and engineers looking to push the boundaries of technological innovation. With its extensive configuration options and adaptive logic modules, this FPGA enables precise customization, enhancing functionality across various industries. Its implementation in 676-pin flip-chip ball grid array (FCBGA) packaging ensures reliable connectivity and simplified integration into complex systems, ensuring that your projects not only meet but exceed the modern standards of tech development.
XC6SLX150-3FG676C Features
The XC6SLX150-3FG676C is equipped with 498 I/O pins, providing extensive connectivity options for multiple peripherals and enabling a wide range of functionalities in system design. Its robust architecture supports advanced digital signal processing, which is crucial for high-speed data analysis and manipulation. This FPGA also boasts a considerable logic capacity, allowing it to handle complex algorithms and multitasking operations efficiently, making it an essential tool for designers looking to optimize their systems for performance and scalability.
XC6SLX150-3FG676C Applications
- Telecommunications: Utilized in routers and switches, the XC6SLX150-3FG676C facilitates faster data transmission and enhances bandwidth management due to its high I/O count and processing capability.
- Automotive: Integral to driver assistance systems, this FPGA helps in processing real-time data from sensors, contributing to safer driving technologies.
- Consumer Electronics: Implemented in high-definition video devices, it supports sophisticated image processing algorithms, ensuring enhanced picture quality.
- Industrial: In automated machinery, the XC6SLX150-3FG676C's adaptability allows it to control complex operations, thereby increasing the efficiency and precision of industrial tasks.
- Medical Devices: Critical in diagnostic equipment, this FPGA accelerates data processing speeds, which is vital for real-time medical imaging and analysis.
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