XC6SLX150-2FGG676C

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Mfr.Part #
XC6SLX150-2FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 498 I/O 676FBGA
Stock
1,042
In Stock :
1,042

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
11519
Clock Frequency :
667MHz
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Package / Case :
676-BGA
Terminal Pitch :
1mm
Number of I/O :
498
Base Part Number :
XC6SLX150
Number of Registers :
184304
Pin Count :
676
Pbfree Code :
yes
Series :
Spartan®-6 LX
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Number of Terminations :
676
JESD-609 Code :
e1
Published :
2008
Terminal Position :
BOTTOM
Total RAM Bits :
4939776
Number of Outputs :
498
Number of Pins :
676
Supply Voltage :
1.2V
Packaging :
Tray
RAM Size :
603kB
Terminal Form :
Ball
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
250
Mount :
Surface Mount
ECCN Code :
3A991.D
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
10 Weeks
Speed Grade :
2
Number of Logic Elements/Cells :
147443
Voltage - Supply :
1.14V~1.26V
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX150-2FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:676-BGA, Base Part Number:XC6SLX150, Number of Terminations:676, Number of Pins:676, XC6SLX150-2FGG676C pinout, XC6SLX150-2FGG676C datasheet PDF, XC6SLX150-2FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX150-2FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX150-2FGG676C


FPGAs AMD Xilinx XC6SLX150-2FGG676C Overview

The FPGAs AMD Xilinx XC6SLX150-2FGG676C is a highly capable field-programmable gate array designed to meet the demanding requirements of modern digital circuits. Engineered by AMD Xilinx, this IC FPGA offers extensive functionality and flexibility, making it an excellent choice for designers looking to push the boundaries of technology. With a total of 498 I/O ports housed in a 676FBGA package, it provides ample connectivity for complex designs requiring numerous interfaces and high-speed communication. This product is particularly suited for applications needing customizable logic solutions that can adapt to varying performance demands.

XC6SLX150-2FGG676C Features

  • Large number of I/O ports: With 498 I/O interfaces, this FPGA allows for extensive peripheral connectivity and flexibility in system design.
  • Dense package: The 676-pin FBGA (Fine Pitch Ball Grid Array) package ensures a compact form factor, which is crucial for space-constrained applications.
  • High-performance logic solutions: Optimized for high-speed and complex digital computations, supporting advanced digital processing tasks.

XC6SLX150-2FGG676C Applications

  • Telecommunications Equipment: Utilized in routers and switches, this FPGA helps manage data traffic efficiently, ensuring robust performance in high-demand scenarios.
  • Automotive Applications: Integrated into driver assistance systems, the XC6SLX150-2FGG676C contributes to processing inputs from vehicle sensors rapidly, enhancing safety features.
  • Consumer Electronics: Used in high-definition video devices, it processes and renders video data, supporting enhanced video functionalities with greater flexibility.
  • Industrial Automation: This FPGA is ideal for control systems in manufacturing environments, where customization and reliability are paramount.
  • Medical Devices: Helps in the processing of complex data in medical imaging systems, ensuring precise diagnostics and robust performance.
This HTML content provides a detailed and structured overview, features list, and applications for the XC6SLX150-2FGG676C FPGA, tailored to attract B2B customers and highlight the product’s versatility in various high-demand applications.
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