XC6SLX100-N3FGG676C
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- Mfr.Part #
- XC6SLX100-N3FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 480 I/O 676FBGA
- Stock
- 8,010
- In Stock ：
- 8,010
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Power Supplies :
- 1.21.2/3.32.5/3.3V
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 101261
- Number of LABs/CLBs :
- 7911
- Number of Terminations :
- 676
- Series :
- Spartan®-6 LX
- Packaging :
- Tray
- ECCN Code :
- 3A991.D
- Operating Temperature :
- 0°C~85°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e1
- Number of Outputs :
- 480
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Total RAM Bits :
- 4939776
- Base Part Number :
- XC6SLX100
- Mount :
- Surface Mount
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Position :
- BOTTOM
- Number of Pins :
- 676
- Number of I/O :
- 480
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Operating Supply Voltage :
- 1.2V
- Published :
- 2008
- RAM Size :
- 603kB
- Supply Voltage :
- 1.2V
- Height Seated (Max) :
- 2.44mm
- Combinatorial Delay of a CLB-Max :
- 0.26 ns
- Length :
- 27mm
- Factory Lead Time :
- 10 Weeks
- Number of Registers :
- 126576
- Terminal Form :
- Ball
- Width :
- 27mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 806MHz
- Peak Reflow Temperature (Cel) :
- 250
- Package / Case :
- 676-BGA
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XC6SLX100-N3FGG676C
FPGAs AMD Xilinx XC6SLX100-N3FGG676C Overview
The FPGAs AMD Xilinx XC6SLX100-N3FGG676C represents a sophisticated embodiment of flexibility and high performance in the realm of field-programmable gate arrays. As a leading-edge product from AMD Xilinx, a titan in silicon innovation, this integrated circuit is tailored to match the intricate demands of high-speed digital signal processing and logic computation. The 676-pin fine-pitch ball grid array (FBGA) packaging helps to ensure a compact footprint while providing ample room for a multitude of I/O options, facilitating its integration into complex, space-constrained systems. With the capability to serve a wide array of industries, this versatile FPGA is a cornerstone component, thrusting high-volume B2B clients into a future where adaptable technology is paramount.
XC6SLX100-N3FGG676C Features
- High-density, low-power 6-Series FPGA technology
- 480 high-performance I/O pins to accommodate versatile design requirements
- Compact 676FBGA package suitable for space-constrained applications
XC6SLX100-N3FGG676C Applications
- Communications Equipment: Integrates seamlessly into infrastructure for routers and switches, leveraging its high I/O count for interfacing with multiple network layers.
- Medical Imaging: Powers demanding applications such as MRI and CT scan image processing with the ability to efficiently handle parallel data streams.
- Industrial Automation: Utilized in control systems requiring a flexible logic solution that can be adapted as automation needs evolve.
- Automotive: Suitable for advanced driver-assistance systems (ADAS) that require significant computational power and reliability in harsh environments.
- Consumer Electronics: Drives innovation in smart home devices by catering to the need for a high degree of device customization while maintaining low power consumption.
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