XC6SLX100-3FG676I
- Mfr.Part #
- XC6SLX100-3FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 480 I/O 676FCBGA
- Stock
- 18,346
- In Stock :
- 18,346
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 1.14V~1.26V
- Package / Case :
- 676-BBGA, FCBGA
- Number of I/O :
- 480
- Pin Count :
- 676
- Terminal Form :
- Ball
- Supply Voltage :
- 1.2V
- Published :
- 2008
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 225
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Total RAM Bits :
- 4939776
- Factory Lead Time :
- 10 Weeks
- Pbfree Code :
- No
- Number of Pins :
- 676
- Number of LABs/CLBs :
- 7911
- Mounting Type :
- Surface Mount
- RAM Size :
- 603kB
- Series :
- Spartan®-6 LX
- Mount :
- Surface Mount
- Qualification Status :
- Not Qualified
- Combinatorial Delay of a CLB-Max :
- 0.21 ns
- Base Part Number :
- XC6SLX100
- Terminal Position :
- BOTTOM
- Speed Grade :
- 3
- Operating Supply Voltage :
- 1.2V
- JESD-609 Code :
- e0
- Number of Logic Elements/Cells :
- 101261
- Height Seated (Max) :
- 2.44mm
- Number of Registers :
- 126576
- Width :
- 27mm
- Number of Terminations :
- 676
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Reach Compliance Code :
- not_compliant
- RoHS Status :
- Non-RoHS Compliant
- Number of Outputs :
- 480
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Pitch :
- 1mm
- Length :
- 27mm
- Clock Frequency :
- 862MHz
- Datasheets
- XC6SLX100-3FG676I

FPGAs AMD Xilinx XC6SLX100-3FG676I Overview
The FPGAs AMD Xilinx XC6SLX100-3FG676I is a high-performance, field-programmable gate array designed to meet the needs of advanced digital processing systems. This IC is optimized for maximum functionality and programmability, with a compact form factor suited for dense board designs. Ideal for applications requiring high-speed data processing and connectivity, the XC6SLX100-3FG676I provides robust interfacing capabilities, facilitated by its 480 I/O pins packaged in a 676-pin flip-chip BGA (FCBGA). This makes it a preferred choice for designers aiming for product miniaturization without compromising on performance.
XC6SLX100-3FG676I Features
The XC6SLX100-3FG676I by AMD Xilinx is equipped with features that enable it to perform optimally in a variety of demanding environments. These include a high-density logic cell structure for efficient signal processing, advanced memory architecture for improved data throughput, and support for various logic configurations. Additionally, its thermal management capabilities ensure reliable operation even under intense operational conditions.
XC6SLX100-3FG676I Applications
- Telecommunications Equipment: Utilized in routers and switches, the XC6SLX100-3FG676I manages high-speed data transmission and switching operations, enhancing network reliability and performance.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS), this FPGA processes inputs from multiple sensors for real-time decision making, improving vehicle safety and functionality.
- Consumer Electronics: Used in high-definition multimedia interfaces (HDMI) and virtual reality devices, the FPGA enables high-speed video processing and immersive multimedia experiences.
- Industrial Automation: In robotic systems, the XC6SLX100-3FG676I facilitates complex control algorithms and real-time processing, leading to enhanced operational efficiency and precision in industrial settings.
- Medical Devices: Implements in imaging systems like MRI and ultrasound, supporting the processing of complex imaging data to produce high-quality diagnostic visuals.
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