XC56L307VL160
- Mfr.Part #
- XC56L307VL160
- Manufacturer
- NXP Semiconductors
- Package / Case
- 196-LBGA
- Datasheet
- Download
- Description
- IC DSP 24BIT FIXED POINT 196-BGA
- Stock
- 7,714
- In Stock :
- 7,714
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- DSP (Digital Signal Processors)
- Clock Rate :
- 160MHz
- Voltage - Core :
- 1.80V
- Voltage - I/O :
- 3.30V
- Mounting Type :
- Surface Mount
- Type :
- FIXED POINT
- Supplier Device Package :
- 196-MAPBGA (15x15)
- Base Part Number :
- XC56L307
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- DSP563xx
- On Chip Data RAM :
- 576kB
- Interface :
- Host Interface, SSI, SCI
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- Package / Case :
- 196-LBGA
- Non-Volatile Memory :
- ROM (576B)
- Operating Temperature :
- -40°C~100°C
- Datasheets
- XC56L307VL160

DSP NXP Semiconductors XC56L307VL160 Overview
The DSP NXP Semiconductors XC56L307VL160 is a high-performance 24-bit fixed point digital signal processor designed for advanced digital signal processing tasks. Engineered by NXP Semiconductors, a leader in semiconductor solutions, this IC is housed in a 196BGA package, offering robust processing capabilities with a compact footprint. Ideal for demanding applications, the XC56L307VL160 delivers exceptional computational power and efficiency, making it a prime choice for developers aiming to implement sophisticated signal processing functions in their hardware designs. Its capacity to handle complex algorithms swiftly makes it a pivotal component in enhancing system performance across various high-tech industries.
XC56L307VL160 Features
The XC56L307VL160 digital signal processor is equipped with numerous features that enhance its utility in complex signal processing. It supports a wide range of signal processing operations, making it incredibly versatile. The processor's 24-bit architecture ensures high-precision calculations, essential for applications requiring detailed and accurate processing. Additionally, its packaging in a 196-ball grid array (BGA) allows for efficient space utilization and improved thermal management, which is critical in high-performance embedded applications.
XC56L307VL160 Applications
- Audio Processing Systems: Utilized in professional audio equipment, the XC56L307VL160 enhances audio clarity and effects processing capabilities, ensuring high-quality sound output in studio and live settings.
- Automotive Electronics: Employs advanced algorithms to manage and improve audio and sensor data processing within automotive systems, contributing to smarter, safer vehicle operations.
- Industrial Control Systems: Applied in controlling and monitoring equipment, this DSP executes complex algorithms that facilitate precise and reliable industrial operations.
- Communication Infrastructure: Integral to the development of communication equipment, the XC56L307VL160 processes signals that maintain and improve the efficiency and reliability of telecommunications networks.
- Medical Imaging Devices: Supports advanced medical imaging systems, such as ultrasound or MRI, by accelerating data processing speeds, which is crucial for high-resolution, real-time imaging.
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