XC56L307VF160

Manufacturer :

NXP Semiconductors

Product Category :

DSP (Digital Signal Processors)

Supply Voltage-Max (Vsup) :

1.9V

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Package / Case :

MAPBGA

Power Supplies :

1.83.3V

External Data Bus Width :

24

Width :

15mm

Temperature Grade :

Industrial

Packaging :

Bulk

Min Operating Temperature :

-40°C

ECCN Code :

3A991

Terminal Position :

BOTTOM

Terminal Finish :

TIN LEAD

Low Power Mode :

yes

Mount :

Surface Mount

Boundary Scan :

yes

Pin Count :

196

HTS Code :

8542.31.00.01

Number of Terminations :

196

Qualification Status :

Not Qualified

JESD-609 Code :

e0

Height Seated (Max) :

1.6mm

Terminal Form :

Ball

Terminal Pitch :

1mm

Number of Pins :

196

Internal Bus Architecture :

Multiple

Format :

FIXED POINT

Bit Size :

24

Lead Free :

Contains Lead

Supply Voltage-Min (Vsup) :

1.7V

Length :

15mm

RAM (words) :

16384

Max Operating Temperature :

100°C

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Peak Reflow Temperature (Cel) :

220

Interface :

SCI

Frequency :

160MHz

RoHS Status :

Non-RoHS Compliant

Reach Compliance Code :

not_compliant

Barrel Shifter :

yes

Address Bus Width :

18

Supply Voltage :

1.8V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

30