XC2S50-6FGG256C
- Mfr.Part #
- XC2S50-6FGG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 10,521
- In Stock :
- 10,521
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- Number of I/O :
- 176
- RAM Size :
- 4kB
- Length :
- 17mm
- Width :
- 17mm
- JESD-609 Code :
- e1
- Height :
- 1.4mm
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Operating Temperature :
- 0°C~85°C TJ
- Speed Grade :
- 6
- Number of Terminations :
- 256
- Terminal Form :
- Ball
- Published :
- 2008
- Number of Logic Elements/Cells :
- 1728
- Supply Voltage :
- 2.5V
- Number of Outputs :
- 176
- Operating Supply Voltage :
- 2.5V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mount :
- Surface Mount
- Number of Pins :
- 256
- Terminal Pitch :
- 1mm
- RoHS Status :
- RoHS Compliant
- Series :
- Spartan®-II
- Packaging :
- Tray
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 2.375V~2.625V
- Number of Gates :
- 50000
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 32768
- Pbfree Code :
- yes
- Package / Case :
- 256-BGA
- Factory Lead Time :
- 10 Weeks
- Number of CLBs :
- 384
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 384
- Peak Reflow Temperature (Cel) :
- 260
- Pin Count :
- 256
- Datasheets
- XC2S50-6FGG256C

FPGAs AMD Xilinx XC2S50-6FGG256C Overview
The AMD Xilinx XC2S50-6FGG256C is a highly versatile and powerful field-programmable gate array (FPGA) designed for a wide array of applications that demand high performance, extensive I/O capabilities, and compact packaging. This FPGA features a robust 256FBGA package, making it ideal for space-constrained environments while still providing a rich feature set and significant flexibility. The XC2S50-6FGG256C is tailored to meet the rigorous demands of modern digital circuits, offering both the programmability and the high-speed interfacing required by today's sophisticated electronic devices.
XC2S50-6FGG256C Features
This AMD Xilinx FPGA is equipped with 176 user I/Os, allowing for extensive connectivity and interfacing with a wide variety of components and peripherals. The 256FBGA package ensures a minimal footprint, while still offering ample room for integrating complex logic circuits and data paths. Its flexible architecture and high integration capability make it an excellent choice for designers looking to push the boundaries of technology in various fields.
XC2S50-6FGG256C Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and smart TVs, the XC2S50-6FGG256C enhances processing capabilities and enables the rapid execution of multiple applications simultaneously.
- Automotive Systems: This FPGA can be integrated into automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and vehicle control modules, offering robust performance and reliability under harsh conditions.
- Industrial Automation: In industrial settings, the XC2S50-6FGG256C drives complex machinery and process control systems, ensuring efficient and reliable operations through high-speed data processing and interfacing capabilities.
- Telecommunications: Employed in network infrastructure and communication devices, it facilitates high-speed data transmission and advanced signal processing tasks necessary for modern telecommunication frameworks.
- Medical Devices: This FPGA supports the development of medical imaging devices such as CT scanners and ultrasound machines, providing the necessary processing power to handle complex imaging algorithms and real-time data analysis.
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