XC2S50-6FGG256C

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Mfr.Part #
XC2S50-6FGG256C
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 176 I/O 256FBGA
Stock
10,521
In Stock :
10,521

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
ECCN Code :
EAR99
Number of I/O :
176
RAM Size :
4kB
Length :
17mm
Width :
17mm
JESD-609 Code :
e1
Height :
1.4mm
Terminal Position :
BOTTOM
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Operating Temperature :
0°C~85°C TJ
Speed Grade :
6
Number of Terminations :
256
Terminal Form :
Ball
Published :
2008
Number of Logic Elements/Cells :
1728
Supply Voltage :
2.5V
Number of Outputs :
176
Operating Supply Voltage :
2.5V
Time@Peak Reflow Temperature-Max (s) :
30
Mount :
Surface Mount
Number of Pins :
256
Terminal Pitch :
1mm
RoHS Status :
RoHS Compliant
Series :
Spartan®-II
Packaging :
Tray
HTS Code :
8542.39.00.01
Voltage - Supply :
2.375V~2.625V
Number of Gates :
50000
Qualification Status :
Not Qualified
Total RAM Bits :
32768
Pbfree Code :
yes
Package / Case :
256-BGA
Factory Lead Time :
10 Weeks
Number of CLBs :
384
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
384
Peak Reflow Temperature (Cel) :
260
Pin Count :
256
Datasheets
XC2S50-6FGG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2S50-6FGG256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:256, Number of Pins:256, Package / Case:256-BGA, XC2S50-6FGG256C pinout, XC2S50-6FGG256C datasheet PDF, XC2S50-6FGG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2S50-6FGG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2S50-6FGG256C


FPGAs AMD Xilinx XC2S50-6FGG256C Overview

The AMD Xilinx XC2S50-6FGG256C is a highly versatile and powerful field-programmable gate array (FPGA) designed for a wide array of applications that demand high performance, extensive I/O capabilities, and compact packaging. This FPGA features a robust 256FBGA package, making it ideal for space-constrained environments while still providing a rich feature set and significant flexibility. The XC2S50-6FGG256C is tailored to meet the rigorous demands of modern digital circuits, offering both the programmability and the high-speed interfacing required by today's sophisticated electronic devices.

XC2S50-6FGG256C Features

This AMD Xilinx FPGA is equipped with 176 user I/Os, allowing for extensive connectivity and interfacing with a wide variety of components and peripherals. The 256FBGA package ensures a minimal footprint, while still offering ample room for integrating complex logic circuits and data paths. Its flexible architecture and high integration capability make it an excellent choice for designers looking to push the boundaries of technology in various fields.

XC2S50-6FGG256C Applications

  • Consumer Electronics: Utilized in devices such as smartphones, tablets, and smart TVs, the XC2S50-6FGG256C enhances processing capabilities and enables the rapid execution of multiple applications simultaneously.
  • Automotive Systems: This FPGA can be integrated into automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and vehicle control modules, offering robust performance and reliability under harsh conditions.
  • Industrial Automation: In industrial settings, the XC2S50-6FGG256C drives complex machinery and process control systems, ensuring efficient and reliable operations through high-speed data processing and interfacing capabilities.
  • Telecommunications: Employed in network infrastructure and communication devices, it facilitates high-speed data transmission and advanced signal processing tasks necessary for modern telecommunication frameworks.
  • Medical Devices: This FPGA supports the development of medical imaging devices such as CT scanners and ultrasound machines, providing the necessary processing power to handle complex imaging algorithms and real-time data analysis.
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