XC2S100-5FG256I

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Mfr.Part #
XC2S100-5FG256I
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 176 I/O 256FBGA
Stock
641
In Stock :
641

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
256-BGA
Number of CLBs :
600
Terminal Finish :
Tin/Lead (Sn63Pb37)
RoHS Status :
Non-RoHS Compliant
Width :
17mm
Mounting Type :
Surface Mount
Supply Voltage :
2.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
17mm
Operating Temperature :
-40°C~100°C TJ
Published :
1999
Mount :
Surface Mount
Pbfree Code :
No
Number of Pins :
256
Terminal Pitch :
1mm
Factory Lead Time :
10 Weeks
RAM Size :
5kB
Operating Supply Voltage :
2.5V
Speed Grade :
5
Time@Peak Reflow Temperature-Max (s) :
30
ECCN Code :
EAR99
Height Seated (Max) :
2mm
Series :
Spartan®-II
Number of Gates :
100000
Number of LABs/CLBs :
600
Terminal Position :
BOTTOM
Number of Outputs :
176
Clock Frequency :
263MHz
Number of Logic Elements/Cells :
2700
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
225
Lead Free :
Contains Lead
Pin Count :
256
Packaging :
Tray
Base Part Number :
XC2S100
Voltage - Supply :
2.375V~2.625V
Combinatorial Delay of a CLB-Max :
0.7 ns
Number of Terminations :
256
Qualification Status :
Not Qualified
Total RAM Bits :
40960
Number of I/O :
176
Terminal Form :
Ball
Datasheets
XC2S100-5FG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2S100-5FG256I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-BGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Pins:256, Base Part Number:XC2S100, Number of Terminations:256, XC2S100-5FG256I pinout, XC2S100-5FG256I datasheet PDF, XC2S100-5FG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2S100-5FG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2S100-5FG256I


FPGAs AMD Xilinx XC2S100-5FG256I Overview

The AMD Xilinx XC2S100-5FG256I, part of the robust Spartan-II FPGA series, offers a highly flexible and scalable solution optimized for a variety of applications requiring high-performance logic integration. This integrated circuit is designed to meet the needs of high-throughput systems with its efficient 256FBGA packaging and 176 I/O pins, facilitating extensive connectivity and interfacing options. As a key player in system-level integration, the XC2S100-5FG256I provides a balance of cost, power, and performance, making it an ideal choice for designers looking to leverage the dynamic advantages of FPGAs in their projects.

XC2S100-5FG256I Features

The XC2S100-5FG256I FPGA features include its robust 256FBGA packaging, which ensures compact and reliable integration into a wide array of electronic assemblies. With 176 I/O pins, it offers extensive interfacing capabilities. The FPGA is designed for optimal performance with Spartan-II architecture, providing an effective solution for processing complex logic operations and enhancing the overall efficiency of technology deployments.

XC2S100-5FG256I Applications

  • Communications Equipment: The XC2S100-5FG256I can be utilized in various communication devices and systems, enhancing data processing speeds and reliability in routers, switches, and base station equipment.
  • Consumer Electronics: This FPGA is ideal for deployment in consumer electronics, such as gaming consoles and high-definition televisions, where high-speed signal processing is crucial for user experience enhancements.
  • Automotive Applications: In automotive technology, the XC2S100-5FG256I supports advanced driver-assistance systems (ADAS) by processing multiple inputs from sensors and cameras, thereby increasing vehicle safety and functionality.
  • Industrial Automation: Suitable for use in automated manufacturing systems, this FPGA can manage complex control systems and machinery operation, leading to improved productivity and operational efficiency.
This structured and detailed description ensures that the product's capabilities and potential applications are clearly communicated to B2B customers, encouraging informed and confident purchasing decisions.
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