XC2S100-6FG456C

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Mfr.Part #
XC2S100-6FG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 196 I/O 456FBGA
Stock
22,796
In Stock :
22,796

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Published :
2004
RAM Size :
5kB
Time@Peak Reflow Temperature-Max (s) :
30
Series :
Spartan®-II
Pin Count :
456
Terminal Form :
Ball
Operating Supply Voltage :
2.5V
HTS Code :
8542.39.00.01
Radiation Hardening :
No
Width :
23mm
Number of Terminations :
456
JESD-609 Code :
e0
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
456-BBGA
Number of Outputs :
260
Number of CLBs :
600
Mount :
Surface Mount
Lead Free :
Contains Lead
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
0°C~85°C TJ
Terminal Position :
BOTTOM
Supply Voltage :
2.5V
Number of Pins :
456
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
2700
Base Part Number :
XC2S100
Number of I/O :
196
Terminal Pitch :
1mm
Voltage - Supply :
2.375V~2.625V
Number of LABs/CLBs :
600
Speed Grade :
6
RoHS Status :
Non-RoHS Compliant
Length :
23mm
Number of Gates :
100000
Total RAM Bits :
40960
Datasheets
XC2S100-6FG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2S100-6FG456C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:456, Package / Case:456-BBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:456, Mounting Type:Surface Mount, Base Part Number:XC2S100, XC2S100-6FG456C pinout, XC2S100-6FG456C datasheet PDF, XC2S100-6FG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2S100-6FG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2S100-6FG456C


FPGAs AMD Xilinx XC2S100-6FG456C Overview

The FPGAs AMD Xilinx XC2S100-6FG456C represents a highly versatile and powerful field-programmable gate array designed for applications requiring high-speed digital processing and flexible hardware configurations. This IC FPGA, housed in a 456FBGA package, offers a robust solution for developers looking to integrate customizable logic devices into their systems. With 196 input/output options, this component supports a variety of digital interfacing requirements, making it ideal for a wide range of industrial, commercial, and telecommunications applications. The key to its versatility lies in its ability to be reprogrammed in the field, allowing for rapid prototyping and updates without needing hardware replacements.

XC2S100-6FG456C Features

This FPGA from AMD Xilinx is engineered with advanced technology to meet the demands of modern digital circuits. The XC2S100-6FG456C features include a substantial number of programmable logic cells, high-speed GPIOs, and support for numerous logic design standards, which are crucial for creating complex digital systems. Additionally, its compact 456-ball fine-pitch BGA packaging ensures minimized space usage while providing ample functionality, making it suitable for dense circuit designs.

XC2S100-6FG456C Applications

  • Telecommunications Infrastructure: Utilized in signal processing, routing, and switching within network devices to enhance performance and reliability.
  • Automotive Systems: Employed in driver assistance systems (ADAS) to process real-time sensory data and to control vehicular functions safely and efficiently.
  • Industrial Automation: Integrated into control systems for manufacturing lines, improving operational efficiency and flexibility through programmable logic controllers.
  • Consumer Electronics: Applied in home entertainment systems, such as smart TVs and gaming consoles, to manage digital content processing and display interfaces.
  • Medical Devices: Crucial in diagnostic and monitoring equipment, where precision and adaptability in processing are paramount.
This HTML structure is designed to clearly communicate the essential aspects of the XC2S100-6FG456C FPGA, highlighting its adaptability and suitability for diverse applications.
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