XC2S50-5FGG256C
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- Mfr.Part #
- XC2S50-5FGG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 4,200
- In Stock ：
- 4,200
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Lead Free :
- Lead Free
- Packaging :
- Tray
- Length :
- 17mm
- Number of Logic Elements/Cells :
- 1728
- Terminal Pitch :
- 1mm
- Number of CLBs :
- 384
- Clock Frequency :
- 263MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e1
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Number of I/O :
- 176
- Speed Grade :
- 5
- Total RAM Bits :
- 32768
- Voltage - Supply :
- 2.375V~2.625V
- ECCN Code :
- EAR99
- Pin Count :
- 256
- Number of LABs/CLBs :
- 384
- Number of Pins :
- 256
- Terminal Position :
- BOTTOM
- Base Part Number :
- XC2S50
- Number of Terminations :
- 256
- Pbfree Code :
- yes
- Factory Lead Time :
- 10 Weeks
- Number of Gates :
- 50000
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 2.5V
- Series :
- Spartan®-II
- Peak Reflow Temperature (Cel) :
- 260
- RoHS Status :
- ROHS3 Compliant
- RAM Size :
- 4kB
- Operating Supply Voltage :
- 2.5V
- Number of Outputs :
- 176
- Height Seated (Max) :
- 2mm
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Published :
- 2008
- Operating Temperature :
- 0°C~85°C TJ
- Width :
- 17mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mount :
- Surface Mount
- Package / Case :
- 256-BGA
- Datasheets
- XC2S50-5FGG256C
FPGAs AMD Xilinx XC2S50-5FGG256C Overview
The AMD Xilinx XC2S50-5FGG256C is a highly capable FPGA (Field Programmable Gate Array) that serves as a pivotal component in a variety of electronic systems. This device is engineered to meet the demanding requirements of modern digital applications, providing a flexible and scalable solution that can be tailored to specific needs. With its robust architecture and significant I/O capabilities, the XC2S50-5FGG256C offers designers the freedom to innovate and optimize their systems for maximum performance and efficiency. Ideal for rapid prototyping and high-volume production, this FPGA is designed to accelerate time-to-market and enhance product reliability.
XC2S50-5FGG256C Features
The XC2S50-5FGG256C features 176 user I/O pins packed into a compact 256FBGA (Fine Ball Grid Array) package, providing ample connectivity for a wide range of applications. The FPGA is built to support complex digital computations while maintaining low power consumption and high data throughput. This makes it an excellent choice for developers looking to implement advanced digital logic with a minimum of physical space and power overhead.
XC2S50-5FGG256C Applications
- Telecommunications Equipment: This FPGA can be utilized to manage signal processing tasks, routing, and switching functions in telecommunications infrastructure, enhancing bandwidth and reducing latency.
- Automotive Systems: In automotive applications, the XC2S50-5FGG256C helps to handle complex control systems and sensor data integration, contributing to more advanced and safer smart-driving features.
- Consumer Electronics: Employed in devices such as high-definition televisions and portable electronics, the FPGA improves processing capabilities, which enhances user experience through faster and more efficient operation.
- Industrial Automation: This product is essential in industrial settings for controlling machinery, automating tasks, and increasing the precision and efficiency of manufacturing processes.
- Medical Devices: The XC2S50-5FGG256C is instrumental in medical imaging and diagnostic equipment, where high-speed data processing is crucial for accurate results.
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