XC2S400E-6FGG456C
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- Mfr.Part #
- XC2S400E-6FGG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 329 I/O 456FBGA
- Stock
- 1,681
- In Stock ：
- 1,681
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Width :
- 23mm
- Terminal Pitch :
- 1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 1.71V~1.89V
- Clock Frequency :
- 357MHz
- Supply Voltage :
- 1.8V
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Pin Count :
- 456
- Package / Case :
- 456-BBGA
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- Series :
- Spartan®-IIE
- Length :
- 23mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 10800
- Total RAM Bits :
- 163840
- Number of Gates :
- 400000
- Number of I/O :
- 329
- JESD-609 Code :
- e1
- Radiation Hardening :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Number of Pins :
- 456
- Number of Outputs :
- 410
- Operating Temperature :
- 0°C~85°C TJ
- Number of Terminations :
- 456
- Lead Free :
- Lead Free
- Number of LABs/CLBs :
- 2400
- RoHS Status :
- RoHS Compliant
- Pbfree Code :
- yes
- ECCN Code :
- 3A991.D
- Number of Equivalent Gates :
- 145000
- Peak Reflow Temperature (Cel) :
- 250
- Speed Grade :
- 6
- Published :
- 2008
- Operating Supply Voltage :
- 1.8V
- RAM Size :
- 20kB
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- Base Part Number :
- XC2S400E
- Mount :
- Surface Mount
- Terminal Form :
- Ball
- Datasheets
- XC2S400E-6FGG456C
FPGAs AMD Xilinx XC2S400E-6FGG456C Overview
Introducing the robust and versatile XC2S400E-6FGG456C from AMD Xilinx, a leading-edge FPGA that offers high functionality and flexibility suited for complex digital processing tasks. This product stands out in the FPGAs AMD Xilinx XC2S400E-6FGG456C category, providing substantial I/O capabilities and a dense 456 FBGA packaging, making it ideal for high-density applications requiring a compact footprint without sacrificing performance. This FPGA is engineered to cater to the demands of both high-speed data processing and low-power consumption, making it a go-to solution for developers looking to push the boundaries of digital design and integration.
XC2S400E-6FGG456C Features
The XC2S400E-6FGG456C FPGA is equipped with 329 I/O pins, housed in a 456-ball fine-pitch Ball Grid Array (FBGA) package, which ensures efficient space utilization and superior connectivity. This FPGA is designed for enhanced performance with a 6ns pin-to-pin logic delay, supporting intricate digital computations at high speeds. The robust design facilitates extensive reprogramming and reconfiguration capabilities, which adapt to evolving technical requirements, thereby extending the lifecycle of the hardware in which it is embedded.
XC2S400E-6FGG456C Applications
- Telecommunications Equipment: Utilized in routers and switches, the XC2S400E-6FGG456C enables high-speed data transmission and efficient network management through its expansive I/O capabilities and rapid processing speeds.
- Consumer Electronics: Ideal for use in high-performance home entertainment systems, this FPGA can process complex audio and video signals, providing enhanced multimedia experiences.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple sensor inputs simultaneously, thus ensuring reliable real-time responsiveness and enhanced vehicle safety.
- Industrial Automation: This FPGA excels in controlling machinery and automated processes, offering precise handling and adaptability to complex industrial environments through its reconfigurable logic gates.
- Medical Devices: Applied in medical imaging systems, such as MRI and ultrasound equipment, to handle intricate signal processing requirements, ensuring detailed and accurate imaging results.
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