XC2S150-6FG256C
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- Mfr.Part #
- XC2S150-6FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 2,457
- In Stock ：
- 2,457
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- ECCN Code :
- EAR99
- Length :
- 17mm
- Number of Logic Elements/Cells :
- 3888
- Number of Pins :
- 256
- Height Seated (Max) :
- 2mm
- Total RAM Bits :
- 49152
- Package / Case :
- 256-BGA
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 2.5V
- Terminal Pitch :
- 1mm
- Peak Reflow Temperature (Cel) :
- 225
- Series :
- Spartan®-II
- Mount :
- Surface Mount
- RAM Size :
- 6kB
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- Number of I/O :
- 176
- Published :
- 2003
- JESD-609 Code :
- e0
- Qualification Status :
- Not Qualified
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of LABs/CLBs :
- 864
- Number of Terminations :
- 256
- Number of CLBs :
- 864
- Base Part Number :
- XC2S150
- Number of Gates :
- 150000
- Number of Outputs :
- 176
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Supply Voltage :
- 2.5V
- Operating Temperature :
- 0°C~85°C TJ
- Pin Count :
- 256
- Lead Free :
- Contains Lead
- Speed Grade :
- 6
- Width :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 2.375V~2.625V
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC2S150-6FG256C
FPGAs AMD Xilinx XC2S150-6FG256C Overview
The FPGAs AMD Xilinx XC2S150-6FG256C is a highly versatile and powerful field-programmable gate array designed for robust digital processing and high-speed interfaces. This device from AMD Xilinx's Spartan-II series is tailored for performance and flexibility in a compact 256FBGA package, offering a broad range of connectivity and configuration options. With its capability to handle 176 I/Os, this FPGA is ideally suited for complex digital integrations in telecommunications, automotive systems, and consumer electronics. The XC2S150-6FG256C ensures efficient deployment of applications requiring substantial logic operations and real-time processing, underlining its utility in advanced electronic systems.
XC2S150-6FG256C Features
This FPGA chip stands out due to its dense integration capability in a small footprint. It offers 176 user I/Os which allow for flexible interfacing with a multitude of peripheral devices. The 256-ball fine pitch BGA package is designed for optimized board space efficiency, making it ideal for compact systems. Additionally, the Spartan-II architecture provides a reliable foundation for developing complex, multi-functional systems with reduced development times and cost.
XC2S150-6FG256C Applications
- Telecommunications Equipment: The XC2S150-6FG256C can be used to facilitate data processing and signal conditioning in routers and switches, enhancing bandwidth and reducing latency.
- Automotive Applications: This FPGA is applicable in vehicle systems for managing sensor inputs, vehicle dynamics control, and in-vehicle networking, improving overall automotive safety and performance.
- Consumer Electronics: It serves as a core component in multimedia devices, gaming consoles, and home entertainment systems, offering high-speed signal processing capabilities that enhance user experience.
- Industrial Automation: The FPGA's adaptability makes it suitable for use in control systems and robotics, where precise operations and real-time decisions are critical.
- Medical Devices: In medical imaging and diagnostic equipment, the XC2S150-6FG256C helps in processing complex algorithms quickly, ensuring faster and more accurate results.
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