XC2S150-5FG456I
- Mfr.Part #
- XC2S150-5FG456I
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 456FBGA
- Stock
- 6,602
- In Stock :
- 6,602
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- Terminal Form :
- Ball
- Number of I/O :
- 260
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Gates :
- 150000
- Speed Grade :
- 5
- JESD-609 Code :
- e0
- RAM Size :
- 6kB
- Number of CLBs :
- 864
- Height Seated (Max) :
- 2.6mm
- Number of Outputs :
- 260
- Mounting Type :
- Surface Mount
- Series :
- Spartan®-II
- Mount :
- Surface Mount
- Published :
- 1999
- ECCN Code :
- 3A991.D
- Clock Frequency :
- 263MHz
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Package / Case :
- 456-BBGA
- Supply Voltage :
- 2.5V
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Operating Supply Voltage :
- 2.5V
- Number of Logic Elements/Cells :
- 3888
- Factory Lead Time :
- 10 Weeks
- Lead Free :
- Contains Lead
- Voltage - Supply :
- 2.375V~2.625V
- Base Part Number :
- XC2S150
- Pbfree Code :
- No
- Pin Count :
- 456
- Operating Temperature :
- -40°C~100°C TJ
- Number of Pins :
- 456
- RoHS Status :
- Non-RoHS Compliant
- Number of Terminations :
- 456
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- not_compliant
- Qualification Status :
- Not Qualified
- Width :
- 23mm
- Packaging :
- Tray
- Length :
- 23mm
- Number of LABs/CLBs :
- 864
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 49152
- Datasheets
- XC2S150-5FG456I

FPGAs AMD Xilinx XC2S150-5FG456I Overview
The FPGAs AMD Xilinx XC2S150-5FG456I is a highly versatile and powerful FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital circuits. Engineered by AMD Xilinx, this integrated circuit excels in delivering high performance with its robust 260 I/O pins packaged neatly in a 456FBGA format. Ideal for a wide range of applications, the XC2S150-5FG456I enables designers to achieve high levels of system integration with the flexibility of field-programmability. This product stands out in the market for its reliability and the ability to support complex digital systems with its advanced technology and significant logic capacity.
XC2S150-5FG456I Features
This FPGA model comes equipped with 260 I/O pins, which are crucial for managing extensive data transfers and high-speed interfaces. The 456-pin FBGA (Fine-pitch Ball Grid Array) packaging ensures a compact form factor while allowing for efficient thermal management and reduced power consumption. The XC2S150-5FG456I is designed for optimal performance in high-demand environments, providing the necessary tools and capabilities to handle complex and multi-layered digital computations.
XC2S150-5FG456I Applications
- Telecommunications: Utilized in network infrastructure to handle signal processing and data flow management, ensuring efficient communication across various channels.
- Consumer Electronics: Integral in developing consumer electronics, such as high-definition televisions and gaming consoles, where high performance and reliability are essential.
- Automotive: Applied in advanced driver-assistance systems (ADAS) to process real-time data from sensors and cameras, enhancing vehicle safety and performance.
- Industrial Automation: Serves as the backbone for control systems in factories, optimizing operations and increasing production efficiency through sophisticated automation and control algorithms.
- Medical Devices: Used in medical imaging equipment, such as MRI and ultrasound machines, to process complex visual data and support diagnostic procedures with enhanced accuracy.
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