XC17S50ASO20I
- Mfr.Part #
- XC17S50ASO20I
- Manufacturer
- AMD Xilinx
- Package / Case
- 20-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC PROM SER 50000 I-TEMP 20-SOIC
- Stock
- 1,023
- In Stock :
- 1,023
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Number of Pins :
- 20
- Number of Terminations :
- 20
- Supply Voltage :
- 3.3V
- Operating Temperature :
- -40°C~85°C
- I/O Type :
- COMMON
- JESD-609 Code :
- e0
- Parallel/Serial :
- Serial
- Terminal Form :
- Gull wing
- Lead Free :
- Contains Lead
- Length :
- 12.8mm
- Pin Count :
- 20
- Height Seated (Max) :
- 2.65mm
- Supply Voltage-Min (Vsup) :
- 3V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Pitch :
- 1.27mm
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Memory Size :
- 500kb
- ECCN Code :
- EAR99
- Surface Mount :
- yes
- Radiation Hardening :
- No
- HTS Code :
- 8542.32.00.71
- Standby Current-Max :
- 0.001A
- Supply Voltage-Max (Vsup) :
- 3.6V
- Package / Case :
- 20-SOIC (0.295, 7.50mm Width)
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Density :
- 1 Mb
- Programmable Type :
- OTP
- Memory IC Type :
- CONFIGURATION MEMORY
- Output Characteristics :
- 3-STATE
- Width :
- 7.5mm
- Supply Current-Max :
- 0.015mA
- Base Part Number :
- XC17S50A
- RoHS Status :
- Non-RoHS Compliant
- Memory Width :
- 1
- Voltage - Supply :
- 3V~3.6V
- Operating Supply Voltage :
- 3.3V
- Mounting Type :
- Surface Mount
- Pbfree Code :
- No
- Packaging :
- Tube
- Terminal Position :
- Dual
- Peak Reflow Temperature (Cel) :
- 225
- Published :
- 1999
- Datasheets
- XC17S50ASO20I

Configuration Proms for FPGAs Manufacturer AMD Xilinx XC17S50ASO20I Overview
Introducing the XC17S50ASO20I by AMD Xilinx, a cutting-edge Integrated Circuit PROM designed to meet the demanding requirements of modern FPGAs. This high-performance device boasts a capacity of 50,000 items per package and comes in a 20SOIC form factor, ensuring seamless integration into your FPGA systems.
With its exceptional reliability and robust construction, the XC17S50ASO20I is the ideal choice for businesses seeking top-of-the-line solutions for their FPGA configuration needs. Trust in AMD Xilinx to deliver excellence in every component.
XC17S50ASO20I Features
- High capacity: With 50,000 items per package, this PROM provides ample storage space for FPGA configurations.
- Compact form factor: The 20SOIC package ensures easy integration into FPGA systems, saving valuable board space.
- Reliable performance: Built to AMD Xilinx's exacting standards, this PROM offers unmatched reliability for critical applications.
- Wide compatibility: Compatible with a range of FPGA systems, ensuring versatility and ease of use.
- Efficient design: Optimized for low power consumption, helping to reduce overall system energy usage.
XC17S50ASO20I Applications
- Data Center Infrastructure: The XC17S50ASO20I is utilized in data center infrastructure for configuring FPGAs in servers, switches, and storage devices. Its high capacity and reliability ensure seamless operation in mission-critical environments.
- Telecommunications Equipment: In telecommunications equipment such as routers and switches, the XC17S50ASO20I plays a vital role in FPGA configuration, enabling efficient data processing and communication. Its compact form factor allows for integration into space-constrained devices.
- Industrial Automation Systems: Industrial automation systems rely on FPGAs for control and monitoring tasks. With the XC17S50ASO20I, manufacturers can easily configure FPGAs to meet the specific requirements of their automation applications, ensuring optimal performance and reliability.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
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