XC1701PD8C
- Mfr.Part #
- XC1701PD8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER C-TEMP 1K 8-DIP
- Stock
- 8
- In Stock :
- 8
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Qualification Status :
- Not Qualified
- Reach Compliance Code :
- not_compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Peak Reflow Temperature (Cel) :
- 225
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Base Part Number :
- XC1701
- Supply Voltage-Min (Vsup) :
- 4.75V
- Terminal Position :
- Dual
- ECCN Code :
- EAR99
- JESD-609 Code :
- e0
- Organization :
- 1MX1
- RoHS Status :
- Non-RoHS Compliant
- Additional Feature :
- USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- Surface Mount :
- No
- Voltage - Supply :
- 4.75V~5.25V
- Number of Terminations :
- 8
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Published :
- 2000
- Supply Voltage :
- 5V
- Number of Functions :
- 1
- Operating Temperature :
- 0°C~70°C
- Programmable Type :
- OTP
- Pin Count :
- 8
- Memory IC Type :
- CONFIGURATION MEMORY
- Standby Current-Max :
- 0.00005A
- Power Supplies :
- 5V
- Operating Mode :
- SYNCHRONOUS
- Supply Voltage-Max (Vsup) :
- 5.25V
- Width :
- 7.62mm
- Length :
- 9.3599mm
- Memory Size :
- 1Mb
- Clock Frequency :
- 15MHz
- Pbfree Code :
- No
- Height Seated (Max) :
- 4.5974mm
- Parallel/Serial :
- Serial
- Mounting Type :
- Through Hole
- Supply Current-Max :
- 0.02mA
- I/O Type :
- COMMON
- Number of Pins :
- 8
- Terminal Pitch :
- 2.54mm
- Packaging :
- Tube
- Lead Free :
- Contains Lead
- Output Characteristics :
- 3-STATE
- Memory Width :
- 1
- Datasheets
- XC1701PD8C

[Configuration Proms for FPGAs - AMD Xilinx XC1701PD8C] Overview
Introducing the XC1701PD8C from AMD Xilinx, a cutting-edge integrated circuit PROM specifically engineered for configuring Field-Programmable Gate Arrays (FPGAs). This compact yet powerful solution redefines efficiency and reliability in the realm of electronic design. With a focus on performance and versatility, the XC1701PD8C empowers engineers and developers to streamline their FPGA configuration processes, ensuring seamless operation and enhanced functionality.
Engineered to meet the rigorous demands of modern electronic applications, the XC1701PD8C boasts exceptional temperature tolerance and robust construction, making it an ideal choice for mission-critical systems across various industries. Its innovative design and advanced features set a new standard for PROMs, delivering unparalleled performance and reliability for diverse FPGA configurations.
[XC1701PD8C] Features
- High-performance IC PROM designed for configuring FPGAs
- Compact 8-pin DIP package for easy integration
- Wide operating temperature range ensures reliability in harsh environments
- 1K bit capacity provides ample storage for configuration data
- Advanced design ensures fast and efficient configuration process
- Compatible with a wide range of FPGA devices
- Robust construction for long-term durability
[XC1701PD8C] Applications
- Embedded Systems: The XC1701PD8C is widely used in embedded systems for configuring FPGAs, enabling seamless integration and optimal performance in applications such as industrial automation, automotive electronics, and medical devices.
- Telecommunications: In telecommunications infrastructure, the XC1701PD8C plays a crucial role in configuring FPGAs for signal processing, data routing, and network management, ensuring reliable and efficient operation in demanding network environments.
- Aerospace and Defense: Aerospace and defense systems rely on the XC1701PD8C for FPGA configuration, enabling the implementation of advanced features such as radar signal processing, electronic warfare, and mission-critical communications, where reliability and performance are paramount.
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