XC17S50APDG8C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

I/O Type :

COMMON

Supply Voltage-Min (Vsup) :

3V

Parallel/Serial :

Serial

Packaging :

Tube

Number of Terminations :

8

Length :

9.3599mm

Pin Count :

8

Height Seated (Max) :

4.5974mm

ECCN Code :

EAR99

Radiation Hardening :

No

Width :

7.62mm

Memory IC Type :

CONFIGURATION MEMORY

Organization :

559200X1

Density :

1 Mb

Terminal Position :

Dual

Time@Peak Reflow Temperature-Max (s) :

30

Pbfree Code :

yes

Peak Reflow Temperature (Cel) :

250

Standby Current-Max :

0.001A

Supply Current-Max :

0.015mA

Mounting Type :

Through Hole

Number of Pins :

8

Supply Voltage-Max (Vsup) :

3.6V

Published :

1999

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Operating Supply Voltage :

3.3V

Output Characteristics :

3-STATE

Base Part Number :

XC17S50A

Supply Voltage :

3.3V

Operating Temperature :

0°C~70°C

Memory Size :

500kb

Memory Width :

1

Number of Functions :

1

Package / Case :

8-DIP (0.300, 7.62mm)

Surface Mount :

No

Terminal Pitch :

2.54mm

Voltage - Supply :

3V~3.6V

RoHS Status :

RoHS Compliant

Terminal Finish :

Matte Tin (Sn)

Programmable Type :

OTP

JESD-609 Code :

e3