XC17S50APD8I

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Mfr.Part #
XC17S50APD8I
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 50000 I-TEMP 8-DIP
Stock
1,792
In Stock :
1,792

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Memory Size :
500kb
Output Characteristics :
3-STATE
Package / Case :
8-DIP (0.300, 7.62mm)
Published :
1999
Terminal Position :
Dual
Pbfree Code :
No
Operating Temperature :
-40°C~85°C
Voltage - Supply :
3V~3.6V
Peak Reflow Temperature (Cel) :
225
Moisture Sensitivity Level (MSL) :
Not Applicable
Supply Voltage-Min (Vsup) :
3V
Surface Mount :
No
I/O Type :
COMMON
Packaging :
Tube
Number of Terminations :
8
Density :
1 Mb
Number of Functions :
1
Length :
9.3599mm
Programmable Type :
OTP
Width :
7.62mm
Height Seated (Max) :
4.5974mm
Supply Current-Max :
0.015mA
Time@Peak Reflow Temperature-Max (s) :
30
Memory IC Type :
CONFIGURATION MEMORY
Pin Count :
8
Operating Supply Voltage :
3.3V
Supply Voltage :
3.3V
Terminal Pitch :
2.54mm
Radiation Hardening :
No
Memory Width :
1
Lead Free :
Contains Lead
ECCN Code :
EAR99
Standby Current-Max :
0.001A
Organization :
559200X1
Parallel/Serial :
Serial
Supply Voltage-Max (Vsup) :
3.6V
JESD-609 Code :
e0
Mounting Type :
Through Hole
Base Part Number :
XC17S50A
RoHS Status :
Non-RoHS Compliant
Number of Pins :
8
Datasheets
XC17S50APD8I
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S50APD8I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:8-DIP (0.300, 7.62mm), Operating Temperature:-40°C~85°C, Number of Terminations:8, Mounting Type:Through Hole, Base Part Number:XC17S50A, Number of Pins:8, XC17S50APD8I pinout, XC17S50APD8I datasheet PDF, XC17S50APD8I amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S50APD8I ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S50APD8I


Configuration Proms for FPGAs AMD Xilinx XC17S50APD8I Overview

Introducing the cutting-edge Configuration Proms for FPGAs by AMD Xilinx, represented by the Mfr.Part XC17S50APD8I. These Integrated Circuits (ICs) redefine efficiency and reliability in digital design. Crafted with precision and innovation, they offer unparalleled performance in serving as the backbone for FPGA configuration.

AMD Xilinx's dedication to excellence is evident in every aspect of these ICs. From meticulous manufacturing standards to rigorous quality control measures, each XC17S50APD8I is a testament to the commitment to delivering top-tier solutions for the industry's most demanding requirements.

Whether you're a seasoned professional or an aspiring innovator, AMD Xilinx's Configuration Proms for FPGAs provide the stability and flexibility needed to bring your designs to life. Experience the future of digital design with the XC17S50APD8I.

XC17S50APD8I Features

  • Highly reliable IC PROM
  • Suitable for FPGA configuration
  • Temperature range: Industrial (I)
  • Package: 8-DIP
  • Capacity: 50000 ITEMP

XC17S50APD8I Applications

  • FPGA Configuration: The XC17S50APD8I excels in configuring Field-Programmable Gate Arrays (FPGAs), ensuring seamless integration and optimal performance in various digital designs and applications.
  • Embedded Systems Development: Leveraging the reliability and versatility of the XC17S50APD8I, embedded systems developers can streamline the configuration process, enabling faster time-to-market for their products.
  • Industrial Automation: In industrial automation settings, where precision and dependability are paramount, the XC17S50APD8I serves as a critical component in controlling and monitoring systems, ensuring smooth and efficient operations.
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