XC17S50APD8C
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- Mfr.Part #
- XC17S50APD8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER 50000 C-TEMP 8-DIP
- Stock
- 1,622
- In Stock ：
- 1,622
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Operating Temperature :
- 0°C~70°C
- Radiation Hardening :
- No
- Parallel/Serial :
- Serial
- Number of Pins :
- 8
- Mounting Type :
- Through Hole
- Length :
- 9.3599mm
- Lead Free :
- Contains Lead
- I/O Type :
- COMMON
- Standby Current-Max :
- 0.001A
- Base Part Number :
- XC17S50A
- Operating Supply Voltage :
- 3.3V
- Height Seated (Max) :
- 4.5974mm
- Voltage - Supply :
- 3V~3.6V
- Output Characteristics :
- 3-STATE
- Terminal Pitch :
- 2.54mm
- Number of Terminations :
- 8
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Pin Count :
- 8
- Number of Functions :
- 1
- Supply Voltage-Min (Vsup) :
- 3V
- Width :
- 7.62mm
- Supply Voltage :
- 3.3V
- Memory IC Type :
- CONFIGURATION MEMORY
- Supply Current-Max :
- 0.015mA
- Density :
- 1 Mb
- Memory Size :
- 500kb
- Packaging :
- Tube
- ECCN Code :
- EAR99
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Supply Voltage-Max (Vsup) :
- 3.6V
- Memory Width :
- 1
- Published :
- 1999
- Pbfree Code :
- No
- Terminal Position :
- Dual
- Organization :
- 559200X1
- RoHS Status :
- Non-RoHS Compliant
- Surface Mount :
- No
- Peak Reflow Temperature (Cel) :
- 225
- Programmable Type :
- OTP
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Datasheets
- XC17S50APD8C
Configuration Proms for FPGAs AMD Xilinx XC17S50APD8C Overview
Introducing the cutting-edge XC17S50APD8C from AMD Xilinx, a premier choice for integrated circuit programmable read-only memory (PROM) solutions. Engineered with precision and reliability in mind, this PROM SER 50000 CTEMP 8DIP device empowers your applications with seamless configuration capabilities, ensuring optimal performance in FPGA systems.
AMD Xilinx's XC17S50APD8C stands out in the market for its robust construction, offering unrivaled durability to withstand extreme temperature conditions. Its compact 8DIP package facilitates easy integration into diverse electronic systems, making it an ideal choice for demanding industrial environments.
Experience unparalleled versatility and efficiency with the XC17S50APD8C, your trusted solution for FPGA configuration needs.
XC17S50APD8C Features
- High-performance PROM SER design
- Capacity: 50000 bits
- Wide temperature range compatibility
- Compact 8DIP package
- Reliable and durable construction
- Industry-leading configuration capabilities
XC17S50APD8C Applications
- Industrial Automation: The XC17S50APD8C plays a critical role in FPGA-based automation systems, facilitating rapid configuration updates for enhanced operational efficiency in manufacturing processes.
- Communications Infrastructure: With its robust design and wide temperature range compatibility, this device excels in telecommunications equipment, ensuring seamless configuration management for reliable network performance.
- Aerospace and Defense: In aerospace and defense applications, the XC17S50APD8C provides secure and reliable configuration storage for mission-critical systems, delivering uncompromised performance in harsh environmental conditions.
- Consumer Electronics: From consumer electronics to automotive applications, the XC17S50APD8C offers versatile configuration solutions, enabling seamless integration and reliable performance in various electronic devices.
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