XC17S40XLPDG8C
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- Mfr.Part #
- XC17S40XLPDG8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM PROG C-TEMP 3.3V 8-DIP
- Stock
- 34,843
- In Stock ：
- 34,843
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Lead Free :
- Lead Free
- Memory Density :
- 330696 bit
- Published :
- 1999
- Number of Terminations :
- 8
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Peak Reflow Temperature (Cel) :
- 250
- Mounting Type :
- Through Hole
- RoHS Status :
- RoHS Compliant
- Reach Compliance Code :
- Unknown
- Operating Mode :
- SYNCHRONOUS
- Length :
- 9.3599mm
- Supply Voltage :
- 3.3V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Memory Size :
- 400kb
- Number of Pins :
- 8
- Supply Current-Max :
- 0.005mA
- Pin Count :
- 8
- ECCN Code :
- EAR99
- Terminal Pitch :
- 2.54mm
- Organization :
- 330696X1
- Qualification Status :
- Not Qualified
- Operating Temperature :
- 0°C~70°C
- JESD-609 Code :
- e3
- Interface :
- Serial
- Supply Voltage-Min (Vsup) :
- 3V
- Terminal Position :
- Dual
- Clock Frequency :
- 10MHz
- Number of Functions :
- 1
- Surface Mount :
- No
- REACH SVHC :
- No SVHC
- I/O Type :
- COMMON
- Height Seated (Max) :
- 4.5974mm
- Voltage - Supply :
- 3V~3.6V
- Termination :
- Through Hole
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Memory Type :
- PROM
- Memory Width :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Power Supplies :
- 3.3V
- Output Characteristics :
- 3-STATE
- Programmable Type :
- OTP
- Base Part Number :
- XC17S40XL
- Width :
- 7.62mm
- Packaging :
- Tube
- Standby Current-Max :
- 0.00005A
- Terminal Finish :
- Matte Tin (Sn)
- Datasheets
- XC17S40XLPDG8C
[Configuration Proms for FPGAs] Overview
Welcome to the realm of cutting-edge electronic solutions with AMD Xilinx's XC17S40XLPDG8C, an IC PROM PROG CTEMP 3.3V 8DIP. Designed for unparalleled performance and reliability, this integrated circuit epitomizes excellence in programmable read-only memory (PROM) technology.
Featuring a robust construction and operating at a nominal voltage of 3.3V, the XC17S40XLPDG8C is engineered to meet the demanding requirements of modern electronic systems. Its compact 8DIP package ensures easy integration into diverse applications, making it an indispensable component for engineers and developers seeking efficient solutions for their projects.
Whether you're delving into FPGA programming or exploring advanced electronic systems, the XC17S40XLPDG8C empowers you with the flexibility and reliability needed to bring your vision to life. Let's delve deeper into its features and explore its wide-ranging applications.
XC17S40XLPDG8C Features
- High-performance PROM technology
- Nominal voltage: 3.3V
- Compact 8DIP package for easy integration
- Robust and reliable design
- Optimized for FPGA configuration
- Enhanced durability for long-term operation
XC17S40XLPDG8C Applications
- FPGA Configuration: The XC17S40XLPDG8C serves as a crucial component in FPGA configuration, enabling seamless programming and reconfiguration of field-programmable gate arrays for a wide range of applications, including telecommunications, automotive, and aerospace.
- Embedded Systems Development: Incorporate the XC17S40XLPDG8C into your embedded systems projects to facilitate efficient program storage and execution in diverse environments, ranging from industrial automation to consumer electronics.
- Data Center Infrastructure: Enhance the performance and reliability of data center infrastructure by leveraging the XC17S40XLPDG8C for storing critical configuration data in servers, switches, and networking equipment, ensuring seamless operation and scalability.
- Automotive Electronics: Ensure the optimal functioning of automotive electronic systems by utilizing the XC17S40XLPDG8C for storing configuration data in engine control units (ECUs), safety systems, and infotainment modules, enhancing vehicle performance, safety, and user experience.
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