XC17S30XLVOG8I

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Height Seated (Max) :

1.2mm

Memory Width :

1

Width :

3.9mm

Standby Current-Max :

0.00005A

JESD-609 Code :

e3

ECCN Code :

EAR99

Published :

1998

I/O Type :

COMMON

RoHS Status :

RoHS Compliant

Peak Reflow Temperature (Cel) :

260

Supply Current-Max :

0.005mA

Operating Mode :

SYNCHRONOUS

Surface Mount :

yes

Output Characteristics :

3-STATE

Qualification Status :

Not Qualified

Memory Size :

300kb

Terminal Finish :

Matte Tin (Sn)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Min (Vsup) :

3V

Packaging :

Tray

Length :

4.9mm

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Form :

Gull wing

Base Part Number :

XC17S30XL

Power Supplies :

3.3V

Operating Temperature :

-40°C~85°C

Supply Voltage :

3.3V

Memory IC Type :

MEMORY CIRCUIT

Mounting Type :

Surface Mount

Voltage - Supply :

3V~3.6V

Number of Terminations :

8

Terminal Position :

Dual

Clock Frequency :

10MHz

Programmable Type :

OTP

Package / Case :

8-SOIC (0.154, 3.90mm Width)

Terminal Pitch :

1.27mm

Number of Functions :

1

Pin Count :

8

Supply Voltage-Max (Vsup) :

3.6V

Number of Pins :

8